MAX1490EACPG+

MAX1490EACPG+

Manufacturer No:

MAX1490EACPG+

Description:

IC TRANSCEIVER FULL 1/1 24DIP

Datasheet:

Datasheet

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MAX1490EACPG+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-PDIP
  • Package / Case
    24-DIP (0.600", 15.24mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    4.5V ~ 5.5V
  • Data Rate
    2.5Mbps
  • Receiver Hysteresis
    70 mV
  • Duplex
    Full
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The MAX1490EACPG+ is a high-speed, low-power, and low-voltage integrated circuit chip designed for use in industrial applications. Some of its advantages and application scenarios include:1. High-Speed Communication: The MAX1490EACPG+ supports high-speed communication up to 25Mbps, making it suitable for applications that require fast data transfer rates.2. Low Power Consumption: This chip operates at low power, making it ideal for battery-powered devices or applications where power efficiency is crucial.3. Low-Voltage Operation: The MAX1490EACPG+ operates at low voltages, typically between 3.3V and 5V, making it compatible with a wide range of systems and devices.4. Robust Industrial Design: The chip is designed to withstand harsh industrial environments, with features like ±15kV ESD protection on the RS-485/RS-422 bus pins, making it suitable for applications in industrial automation, process control, and instrumentation.5. Multi-Drop Bus Capability: The MAX1490EACPG+ supports multi-drop bus configurations, allowing multiple devices to be connected on a single bus, simplifying system design and reducing wiring complexity.6. Wide Temperature Range: The chip can operate in a wide temperature range, typically from -40°C to +85°C, making it suitable for applications in extreme temperature environments.7. Industrial Automation: The MAX1490EACPG+ can be used in industrial automation systems for communication between various devices, such as sensors, actuators, and controllers.8. Process Control: It can be used in process control systems to enable communication between different components, such as PLCs (Programmable Logic Controllers), HMI (Human-Machine Interface) devices, and remote I/O modules.9. Instrumentation: The chip can be utilized in instrumentation systems for data acquisition and control, allowing for reliable and high-speed communication between measurement devices and control units.10. Building Automation: It can be employed in building automation systems for communication between different subsystems, such as HVAC (Heating, Ventilation, and Air Conditioning), lighting control, and security systems.Overall, the MAX1490EACPG+ integrated circuit chip offers high-speed, low-power, and robust communication capabilities, making it suitable for various industrial applications that require reliable and efficient data transfer.