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FIN1019MTC Specifications
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TypeParameter
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Supplier Device Package14-TSSOP
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Package / Case14-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply3V ~ 3.6V
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Data Rate400Mbps
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DuplexFull
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Number of Drivers/Receivers1/1
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ProtocolLVDS
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TypeTransceiver
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PackagingTube
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Product StatusObsolete
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Series-
The FIN1019MTC integrated circuit chips have several advantages and application scenarios:1. High-speed data transmission: The FIN1019MTC chips are designed for high-speed data transmission applications, offering data rates up to 2.5 Gbps. This makes them suitable for applications that require fast and reliable data transfer.2. Low power consumption: These chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial.3. Small form factor: The FIN1019MTC chips come in a compact form factor, making them suitable for space-constrained applications. They can be easily integrated into small devices or systems.4. Wide operating temperature range: These chips can operate in a wide temperature range, typically from -40°C to +85°C. This makes them suitable for applications that require operation in extreme temperature conditions.5. Application scenarios: The FIN1019MTC chips find applications in various fields, including telecommunications, networking, data centers, and industrial automation. They can be used in optical transceivers, fiber optic communication systems, high-speed data links, and other similar applications.Overall, the advantages of the FIN1019MTC integrated circuit chips, such as high-speed data transmission, low power consumption, small form factor, and wide operating temperature range, make them suitable for a range of applications where fast and reliable data transfer is required.
FIN1019MTC Relevant information
