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MC33399DR2

MC33399DR2

Manufacturer No:

MC33399DR2

Manufacturer:

NXP USA Inc.

Description:

IC TRANSCEIVER HALF 1/1 8SOIC

Datasheet:

Datasheet

Delivery:

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MC33399DR2 Specifications

  • Type
    Parameter
  • Receiver Hysteresis
    50 mV
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    7V ~ 18V
  • Data Rate
    20kbps
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    LINbus
  • Type
    Transceiver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MC33399DR2 is a specific integrated circuit (IC) chip designed for automotive applications. It is a system basis chip (SBC) that provides various advantages and can be used in different scenarios. Some of the advantages and application scenarios of the MC33399DR2 IC chip are:1. Power Management: The MC33399DR2 integrates multiple power management functions, including voltage regulators, power switches, and protection features. This allows for efficient power distribution and control in automotive systems.2. System Integration: The IC chip combines several essential functions into a single device, reducing the need for multiple discrete components. This integration simplifies the design process, saves board space, and lowers overall system cost.3. Automotive Applications: The MC33399DR2 is specifically designed for automotive applications, making it suitable for use in various automotive systems. It can be used in body control modules, lighting systems, HVAC systems, powertrain control modules, and other automotive electronic systems.4. Enhanced Safety and Reliability: The IC chip incorporates protection features such as overvoltage protection, overcurrent protection, and thermal shutdown. These features enhance the safety and reliability of automotive systems by preventing damage due to voltage spikes, excessive current, or overheating.5. Diagnostic and Communication Capabilities: The MC33399DR2 supports communication protocols like LIN (Local Interconnect Network) and provides diagnostic features. This enables the chip to communicate with other components in the system and facilitate diagnostics, fault detection, and troubleshooting.6. Low Power Consumption: The IC chip is designed to operate with low power consumption, making it suitable for automotive systems where energy efficiency is crucial. This helps in reducing overall power consumption and extending the battery life of the vehicle.Overall, the MC33399DR2 IC chip offers advantages such as power management, system integration, automotive-specific design, enhanced safety, diagnostic capabilities, and low power consumption. These features make it a versatile and reliable choice for various automotive applications.
MC33399DR2 Relevant information