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MC33390DR2

MC33390DR2

Manufacturer No:

MC33390DR2

Manufacturer:

NXP USA Inc.

Description:

IC TRANSCEIVER HALF 1/1 8SOIC

Datasheet:

Datasheet

Delivery:

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MC33390DR2 Specifications

  • Type
    Parameter
  • Receiver Hysteresis
    200 mV
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    9V ~ 16V
  • Data Rate
    10.4Kbps
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    -
  • Type
    Transceiver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MC33390DR2 is a specific integrated circuit (IC) chip designed for automotive applications. It is a LIN (Local Interconnect Network) transceiver, which means it enables communication between various electronic control units (ECUs) in a vehicle.Advantages of the MC33390DR2 IC chip: 1. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for automotive applications where power efficiency is crucial. 2. Robust communication: It provides reliable communication between different ECUs, ensuring data integrity and minimizing errors. 3. ESD protection: The chip offers built-in electrostatic discharge (ESD) protection, safeguarding the communication system from potential damage due to static electricity. 4. Wide operating voltage range: It can operate within a wide voltage range, typically from 5V to 18V, making it compatible with various automotive systems. 5. Compact size: The IC chip is available in a small package, allowing for space-efficient integration into automotive electronic systems.Application scenarios of the MC33390DR2 IC chip: 1. Automotive networking: It is commonly used in automotive networking systems, where multiple ECUs need to communicate with each other. This includes applications such as body control modules, powertrain control modules, and instrument clusters. 2. Infotainment systems: The chip can be utilized in infotainment systems to enable communication between different components, such as audio systems, displays, and user interfaces. 3. Lighting control: It can be employed in lighting control systems within vehicles, allowing for communication between lighting modules and control units. 4. Climate control: The IC chip can facilitate communication between climate control modules, enabling efficient control and coordination of heating, ventilation, and air conditioning systems. 5. Safety systems: It can be used in safety-related applications, such as airbag control modules, where reliable communication between different safety systems is crucial.Overall, the MC33390DR2 IC chip offers advantages like low power consumption, robust communication, and ESD protection, making it suitable for various automotive applications that require reliable and efficient communication between different electronic control units.
MC33390DR2 Relevant information