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MAX3070EEPD
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MAX3070EEPD
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Description:
IC TRANSCEIVER FULL 1/1 14DIP
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MAX3070EEPD Specifications
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TypeParameter
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Supplier Device Package14-PDIP
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Package / Case14-DIP (0.300", 7.62mm)
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Mounting TypeThrough Hole
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply3V ~ 3.6V
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Data Rate250kbps
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Receiver Hysteresis100 mV
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DuplexFull
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Number of Drivers/Receivers1/1
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ProtocolRS422, RS485
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TypeTransceiver
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PackagingTube
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PackagingTube
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Product StatusObsolete
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Series-
The MAX3070EEPD is a high-speed, low-power, and low-voltage integrated circuit chip designed for use in industrial control systems, factory automation, and process control applications. Some of the advantages and application scenarios of the MAX3070EEPD are:1. High-Speed Communication: The MAX3070EEPD supports high-speed communication protocols such as RS-485/RS-422, allowing for reliable and fast data transmission over long distances.2. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Robust Industrial Design: The MAX3070EEPD is built to withstand harsh industrial environments, with features like ±15kV ESD protection, wide temperature range (-40°C to +125°C), and high noise immunity.4. Integrated Protection Features: The chip includes various protection features like short-circuit protection, thermal shutdown, and fail-safe receiver inputs, ensuring the safety and reliability of the communication system.5. Wide Supply Voltage Range: The MAX3070EEPD supports a wide supply voltage range from 3.0V to 5.5V, making it compatible with a variety of power sources.Application scenarios for the MAX3070EEPD include:1. Industrial Automation: The chip can be used in industrial automation systems to enable reliable and high-speed communication between various devices, such as sensors, actuators, and controllers.2. Process Control: The MAX3070EEPD can be employed in process control applications, where it facilitates communication between different components of a control system, ensuring accurate and timely data exchange.3. Building Automation: The chip can be utilized in building automation systems to enable communication between different subsystems, such as HVAC, lighting, and security systems, allowing for centralized control and monitoring.4. Energy Management: The MAX3070EEPD can be integrated into energy management systems to enable communication between energy meters, smart grid devices, and control units, facilitating efficient energy monitoring and control.5. Transportation Systems: The chip can be used in transportation systems, such as railway networks or traffic control systems, to enable reliable and fast communication between various subsystems, ensuring smooth operation and safety.Overall, the MAX3070EEPD integrated circuit chip offers advantages like high-speed communication, low power consumption, robust design, and integrated protection features, making it suitable for a wide range of industrial control and automation applications.
MAX3070EEPD Relevant information
