E-STE100P

E-STE100P

Manufacturer No:

E-STE100P

Manufacturer:

STMicroelectronics

Description:

IC TRANSCEIVER HALF 1/1 64TQFP

Datasheet:

Datasheet

Delivery:

Payment:

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E-STE100P Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-TQFP (10x10)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3.15V ~ 3.45V
  • Data Rate
    -
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    MII
  • Type
    Transceiver
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The E-STE100P integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The E-STE100P chips offer high-speed data transmission and processing capabilities, making them suitable for applications that require real-time data processing. 2. Low Power Consumption: These chips are designed to operate efficiently with low power consumption, making them ideal for battery-powered devices or energy-efficient applications. 3. Compact Size: The E-STE100P chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Robust Communication: These chips provide reliable and robust communication capabilities, ensuring seamless data transmission even in challenging environments. 5. Secure Communication: The E-STE100P chips support various security features, such as encryption and authentication, ensuring secure communication between devices.Application Scenarios: 1. Internet of Things (IoT): The E-STE100P chips can be used in IoT devices to enable seamless communication between connected devices, allowing for efficient data exchange and control. 2. Industrial Automation: These chips can be utilized in industrial automation systems to enable real-time communication between sensors, actuators, and control systems, facilitating efficient and reliable automation processes. 3. Automotive: The E-STE100P chips can be integrated into automotive systems to enable secure and high-speed communication between various components, such as engine control units, infotainment systems, and sensors. 4. Smart Grids: These chips can be used in smart grid systems to enable efficient communication between power generation, distribution, and consumption devices, facilitating intelligent energy management and monitoring. 5. Telecommunications: The E-STE100P chips can be employed in telecommunications equipment, such as routers and switches, to enable high-speed and secure data transmission between network devices.Overall, the E-STE100P integrated circuit chips offer high performance, low power consumption, and secure communication capabilities, making them suitable for a wide range of applications in various industries.