MAX3072EEPA
Manufacturer No:
MAX3072EEPA
Manufacturer:
Description:
IC TRANSCEIVER HALF 1/1 8DIP
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MAX3072EEPA Specifications
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TypeParameter
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Supplier Device Package8-PDIP
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Package / Case8-DIP (0.300", 7.62mm)
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Mounting TypeThrough Hole
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply2.97V ~ 3.63V
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Data Rate250kbps
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Receiver Hysteresis15 mV
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DuplexHalf
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Number of Drivers/Receivers1/1
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ProtocolRS422, RS485
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TypeTransceiver
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PackagingBulk
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Product StatusActive
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Series-
The MAX3072EEPA is a high-speed, low-power, and low-voltage integrated circuit chip designed for use in industrial control systems, process automation, and other applications that require robust communication interfaces. Some of the advantages and application scenarios of the MAX3072EEPA are:1. Robust Communication: The chip supports RS-485/RS-422 communication standards, which are widely used in industrial applications. It provides excellent noise immunity and can operate in harsh environments, making it suitable for industrial control systems.2. High-Speed Data Transfer: The MAX3072EEPA supports data rates up to 40Mbps, enabling fast and efficient communication between devices. This makes it suitable for applications that require high-speed data transfer, such as process automation and data acquisition systems.3. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. It helps in reducing overall power consumption and extending battery life.4. Wide Supply Voltage Range: The MAX3072EEPA operates over a wide supply voltage range of 3.0V to 5.5V, providing flexibility in various applications. It can be easily integrated into existing systems with different power supply configurations.5. ESD Protection: The chip incorporates built-in electrostatic discharge (ESD) protection, safeguarding the communication interface against potential damage from electrostatic discharge events. This ensures the reliability and longevity of the system.Application scenarios for the MAX3072EEPA include:1. Industrial Automation: The chip can be used in industrial control systems, PLCs (Programmable Logic Controllers), and SCADA (Supervisory Control and Data Acquisition) systems to enable reliable and high-speed communication between various devices and sensors.2. Process Automation: The MAX3072EEPA can be utilized in process automation applications, such as manufacturing plants, to facilitate communication between different equipment and control units. It ensures accurate and timely data exchange for efficient process control.3. Data Acquisition Systems: The chip can be employed in data acquisition systems that require high-speed data transfer, such as in scientific research or monitoring applications. It enables the acquisition and transmission of data from multiple sensors or measurement devices.4. Building Automation: The MAX3072EEPA can be used in building automation systems to establish communication between different subsystems, such as HVAC (Heating, Ventilation, and Air Conditioning), lighting control, and security systems. It enables efficient control and monitoring of building infrastructure.5. Energy Management Systems: The chip can be integrated into energy management systems to enable communication between energy meters, smart grid devices, and control units. It facilitates real-time monitoring and control of energy consumption, aiding in energy efficiency and cost optimization.Overall, the MAX3072EEPA integrated circuit chip offers robust communication capabilities, high-speed data transfer, low power consumption, and wide application versatility, making it suitable for various industrial and automation scenarios.
MAX3072EEPA Relevant information