SN65LVDS387DGGR

SN65LVDS387DGGR

Manufacturer No:

SN65LVDS387DGGR

Manufacturer:

Texas Instruments

Description:

IC DRIVER 16/0 64TSSOP

Datasheet:

Datasheet

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SN65LVDS387DGGR Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-TSSOP
  • Package / Case
    64-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Data Rate
    630Mbps
  • Duplex
    -
  • Number of Drivers/Receivers
    16/0
  • Protocol
    LVDS
  • Type
    Driver
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    65LVDS
The SN65LVDS387DGGR integrated circuit chip offers several advantages and is suitable for various application scenarios. Some of the advantages and application scenarios of this chip are:1. High-speed data transmission: The chip is designed to support high-speed data transmission, making it ideal for applications that require rapid data transfer rates.2. Low voltage differential signaling (LVDS) interface: The chip uses LVDS technology, which provides low-power data transmission without compromising on data integrity. This makes it suitable for applications where power efficiency is critical.3. Wide operating voltage range: The chip operates over a wide voltage range, typically from 3V to 3.6V. This makes it compatible with a variety of electronic systems and devices.4. EMI/RFI noise reduction: The chip incorporates features to reduce electromagnetic interference (EMI) and radio frequency interference (RFI) noise. This makes it suitable for applications where noise reduction is important, such as in audio/video systems or communication equipment.5. Driver and receiver circuits: The chip integrates both driver and receiver circuits, reducing the need for external components. This simplifies the design and assembly process, making it cost-effective and saving valuable circuit board space.6. Industrial and automotive applications: The chip is suitable for industrial and automotive applications due to its robustness, reliability, and ability to withstand harsh operating conditions.Some specific application scenarios for the SN65LVDS387DGGR chip include:a) High-speed data communication: This chip can be used in applications that require high-speed data communication, such as data centers, servers, and telecommunications equipment.b) Display interfaces: The chip can be utilized in display interfaces like LCD monitors, video walls, and LED screens, where fast and high-quality data transmission is essential.c) Automotive infotainment systems: The chip can be employed in automotive infotainment systems to transmit audio and video data between various components, ensuring reliable and interference-free signaling.d) Industrial control systems: The chip can be used in industrial control systems for connecting sensors, actuators, and other devices, transmitting critical control signals with high-speed and reliability.e) Medical imaging systems: The chip can be incorporated into medical imaging systems, such as ultrasound machines or digital X-ray systems, to ensure fast and accurate data transmission.Overall, the SN65LVDS387DGGR integrated circuit chip offers advantages such as high-speed data transmission, low-power operation, noise reduction, and wide voltage range, making it suitable for a range of applications requiring fast and reliable data communication.