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MCZ33897TEF

MCZ33897TEF

Manufacturer No:

MCZ33897TEF

Manufacturer:

NXP USA Inc.

Description:

IC TRANSCEIVER HALF 1/1 14SOIC

Datasheet:

Datasheet

Delivery:

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MCZ33897TEF Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    12V
  • Data Rate
    83.33Kbps
  • Receiver Hysteresis
    500 mV
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    CANbus
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MCZ33897TEF is a specific integrated circuit chip designed for automotive applications. It is a LIN (Local Interconnect Network) transceiver, which means it enables communication between various electronic control units (ECUs) in a vehicle. Here are some advantages and application scenarios of the MCZ33897TEF:Advantages: 1. Robust Communication: The MCZ33897TEF provides reliable communication over the LIN bus, ensuring data integrity and error detection. 2. Low Power Consumption: It is designed to operate with low power consumption, making it suitable for automotive applications where energy efficiency is crucial. 3. ESD Protection: The chip offers built-in electrostatic discharge (ESD) protection, safeguarding the communication system from potential damage due to static electricity. 4. Compact Size: The MCZ33897TEF is available in a small package, making it suitable for space-constrained automotive environments.Application Scenarios: 1. Automotive Body Control Modules: The chip can be used in body control modules to facilitate communication between various components like door locks, window controls, lighting systems, and more. 2. Infotainment Systems: It can be employed in infotainment systems to enable communication between different modules like audio systems, displays, and user interfaces. 3. Climate Control Systems: The MCZ33897TEF can be utilized in climate control systems to connect ECUs responsible for controlling temperature, fan speed, and other climate-related functions. 4. Seat Control Systems: It can be used in seat control systems to enable communication between ECUs responsible for adjusting seat positions, heating/cooling functions, and memory settings.Overall, the MCZ33897TEF integrated circuit chip is specifically designed for automotive LIN communication, providing reliable and efficient data transfer between various ECUs in a vehicle.
MCZ33897TEF Relevant information