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MC33897CTEFR2

MC33897CTEFR2

Manufacturer No:

MC33897CTEFR2

Manufacturer:

Freescale Semiconductor

Description:

IC TRANSCEIVER HALF 1/1 14SOIC

Datasheet:

Datasheet

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MC33897CTEFR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Receiver Hysteresis
    500 mV
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    12V
  • Data Rate
    83.33Kbps
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    CANbus
  • Type
    Transceiver
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MC33897CTEFR2 is a specific integrated circuit chip designed by NXP Semiconductors. It is primarily used in automotive applications, specifically for LIN (Local Interconnect Network) communication systems. Here are some advantages and application scenarios of the MC33897CTEFR2:Advantages: 1. LIN Communication: The chip is specifically designed for LIN communication, which is a low-cost, low-speed communication protocol used in automotive applications. It enables communication between various electronic control units (ECUs) in a vehicle.2. High Integration: The MC33897CTEFR2 integrates several functions required for LIN communication, including LIN transceiver, voltage regulator, and wake-up functionality. This high level of integration reduces the need for external components and simplifies the design process.3. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for automotive applications where power efficiency is crucial.4. Robustness and Reliability: The MC33897CTEFR2 is designed to withstand the harsh automotive environment, including temperature variations, electromagnetic interference, and voltage fluctuations. It provides robust and reliable communication in such conditions.Application Scenarios: 1. Automotive Body Control Modules: The chip can be used in body control modules (BCMs) to enable communication between various components, such as door locks, windows, lighting systems, and seat controls. It allows for centralized control and monitoring of these functions.2. Infotainment Systems: The MC33897CTEFR2 can be used in infotainment systems to facilitate communication between different components, such as audio systems, displays, and user interfaces. It enables seamless integration and control of these systems.3. Climate Control Systems: The chip can be utilized in climate control systems to enable communication between different components, such as temperature sensors, HVAC (Heating, Ventilation, and Air Conditioning) units, and control panels. It allows for efficient control and monitoring of the climate control functions.4. Lighting Systems: The MC33897CTEFR2 can be employed in lighting systems, such as exterior lighting or interior ambient lighting, to enable communication between different lighting modules. It allows for synchronized control and customization of the lighting effects.Overall, the MC33897CTEFR2 integrated circuit chip offers advantages like LIN communication support, high integration, low power consumption, and robustness, making it suitable for various automotive applications requiring reliable and efficient communication.
MC33897CTEFR2 Relevant information