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MAX3160ECAP+

MAX3160ECAP+

Manufacturer No:

MAX3160ECAP+

Description:

IC TRANSCEIVER FULL 2/2 20SSOP

Datasheet:

Datasheet

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MAX3160ECAP+ Specifications

  • Type
    Parameter
  • Receiver Hysteresis
    500 mV
  • Supplier Device Package
    20-SSOP
  • Package / Case
    20-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3V ~ 5.5V
  • Data Rate
    10Mbps
  • Duplex
    Full
  • Number of Drivers/Receivers
    2/2
  • Protocol
    RS232, RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MAX3160ECAP+ is a high-speed, low-power, and low-voltage level translator integrated circuit chip. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the MAX3160ECAP+ are:Advantages: 1. High-Speed Operation: The MAX3160ECAP+ supports data rates up to 250Mbps, making it suitable for high-speed communication applications. 2. Low Power Consumption: It operates at a low supply voltage (1.65V to 3.6V) and consumes minimal power, making it ideal for battery-powered devices or applications where power efficiency is crucial. 3. Bidirectional Level Translation: The chip provides bidirectional voltage level translation between two different voltage domains, allowing seamless communication between devices operating at different voltage levels. 4. Small Package Size: The MAX3160ECAP+ is available in a compact package, saving board space and enabling integration into space-constrained designs.Application Scenarios: 1. I2C/SMBus Level Translation: The MAX3160ECAP+ can be used to interface devices operating at different voltage levels in I2C or SMBus communication systems. It ensures proper voltage translation between devices, enabling them to communicate effectively. 2. UART/RS-232 Level Shifting: It can be employed in UART or RS-232 communication interfaces to translate voltage levels between devices with different voltage requirements. This allows seamless communication between devices operating at different voltage levels. 3. SPI/SDIO Level Translation: The chip can be utilized in SPI or SDIO interfaces to enable voltage level translation between devices operating at different voltage domains. This ensures compatibility and reliable data transfer between devices. 4. Battery-Powered Devices: Due to its low power consumption, the MAX3160ECAP+ is suitable for applications powered by batteries or low-power sources. It helps conserve power and extend battery life in portable devices such as smartphones, tablets, or wearables.Overall, the MAX3160ECAP+ offers high-speed, low-power, bidirectional level translation capabilities, making it versatile for various communication interfaces and applications.
MAX3160ECAP+ Relevant information