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MAX3070EESD+

MAX3070EESD+

Manufacturer No:

MAX3070EESD+

Description:

IC TRANSCEIVER FULL 1/1 14SOIC

Datasheet:

Datasheet

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MAX3070EESD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Data Rate
    250kbps
  • Receiver Hysteresis
    100 mV
  • Duplex
    Full
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MAX3070EESD+ is a high-speed, low-power, and low-voltage integrated circuit chip designed for use in industrial control systems, factory automation, and process control applications. Some of the advantages and application scenarios of the MAX3070EESD+ are:1. High-Speed Communication: The MAX3070EESD+ supports high-speed communication protocols such as RS-485/RS-422, allowing for reliable and fast data transmission over long distances.2. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Robust Industrial Design: The MAX3070EESD+ is built to withstand harsh industrial environments, with features like ±15kV ESD protection on the bus pins, wide temperature range (-40°C to +85°C), and high noise immunity.4. Integrated Protection Features: The chip includes various protection features like short-circuit protection, thermal shutdown, and fail-safe receiver inputs, ensuring the reliability and safety of the communication system.5. Wide Supply Voltage Range: The MAX3070EESD+ supports a wide supply voltage range from 3V to 5.5V, making it compatible with a variety of power sources.Application scenarios for the MAX3070EESD+ include:1. Industrial Automation: The chip can be used in industrial automation systems to enable reliable and high-speed communication between various devices, such as sensors, actuators, and controllers.2. Process Control: The MAX3070EESD+ can be employed in process control applications, where it facilitates communication between different components of a control system, ensuring accurate and timely data exchange.3. Building Automation: The chip can be utilized in building automation systems to enable communication between different subsystems, such as HVAC, lighting, and security systems, allowing for centralized control and monitoring.4. Energy Management: The MAX3070EESD+ can be integrated into energy management systems to enable communication between energy meters, smart grid devices, and control units, facilitating efficient energy monitoring and control.5. Transportation Systems: The chip can be used in transportation systems, such as railway networks or traffic control systems, to enable reliable and fast communication between various subsystems, ensuring smooth operation and safety.Overall, the MAX3070EESD+ integrated circuit chip offers high-speed communication, low power consumption, and robust industrial design, making it suitable for a wide range of industrial control and automation applications.
MAX3070EESD+ Relevant information