MAX3071EESA+
Manufacturer No:
MAX3071EESA+
Manufacturer:
Description:
IC TRANSCEIVER FULL 1/1 8SOIC
Datasheet:
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In Stock : 3017
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MAX3071EESA+ Specifications
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TypeParameter
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Supplier Device Package8-SOIC
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Package / Case8-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply3V ~ 3.6V
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Data Rate250kbps
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Receiver Hysteresis100 mV
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DuplexFull
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Number of Drivers/Receivers1/1
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ProtocolRS422, RS485
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TypeTransceiver
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PackagingTube
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Product StatusActive
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Series-
The MAX3071EESA+ is a high-speed, low-power, and low-voltage integrated circuit chip designed for use in industrial control systems, process automation, and other applications that require robust communication over long distances. Some of the advantages and application scenarios of the MAX3071EESA+ are:1. Robust Communication: The chip supports RS-485/RS-422 communication standards, which provide robust and noise-immune data transmission over long distances. It can handle data rates up to 40Mbps, making it suitable for high-speed communication applications.2. Low Power Consumption: The MAX3071EESA+ is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Wide Supply Voltage Range: The chip can operate from a wide supply voltage range of 3.3V to 5V, allowing flexibility in system design and compatibility with various power sources.4. Integrated Protection Features: The MAX3071EESA+ incorporates various protection features like short-circuit protection, thermal shutdown, and receiver fail-safe mode, ensuring reliable operation and safeguarding against potential faults or damage.5. Industrial Applications: The chip is commonly used in industrial control systems, process automation, building automation, and other applications where reliable and noise-immune communication is required. It can be used in applications such as motor control, sensor networks, PLCs (Programmable Logic Controllers), and HMI (Human-Machine Interface) systems.6. Long-Distance Communication: With its robust communication capabilities, the MAX3071EESA+ can support long-distance communication up to several kilometers, making it suitable for applications that require data transmission over extended distances.7. Multi-Drop Networks: The chip supports multi-drop network topologies, allowing multiple devices to be connected on a single communication bus. This makes it ideal for applications where multiple devices need to communicate with a central controller or with each other.Overall, the MAX3071EESA+ integrated circuit chip offers advantages such as robust communication, low power consumption, wide supply voltage range, and integrated protection features. Its application scenarios include industrial control systems, process automation, building automation, and other applications that require reliable and noise-immune communication over long distances.
MAX3071EESA+ Relevant information