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LTC2875HDD#PBF

LTC2875HDD#PBF

Manufacturer No:

LTC2875HDD#PBF

Manufacturer:

Analog Devices Inc.

Description:

IC TRANSCEIVER 1/1 8DFN

Datasheet:

Datasheet

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LTC2875HDD#PBF Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-DFN (3x3)
  • Package / Case
    8-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    3V ~ 3.6V, 4.5V ~ 5.5V
  • Data Rate
    4Mbps
  • Duplex
    -
  • Number of Drivers/Receivers
    1/1
  • Protocol
    CANbus
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The LTC2875HDD#PBF is a high-speed RS485/RS422 transceiver integrated circuit chip manufactured by Linear Technology (now part of Analog Devices). It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the LTC2875HDD#PBF chip are:Advantages: 1. High-Speed Communication: The LTC2875HDD#PBF chip supports data rates up to 40Mbps, making it suitable for high-speed communication applications. 2. Robust and Reliable: It features ±60V overvoltage fault protection on the bus pins, which helps protect the chip from voltage spikes and ensures reliable operation in harsh industrial environments. 3. Low Power Consumption: The chip has low power consumption, making it suitable for battery-powered applications or situations where power efficiency is crucial. 4. Wide Supply Voltage Range: It operates from a wide supply voltage range of 3V to 5.5V, allowing flexibility in various power supply configurations. 5. ESD Protection: The LTC2875HDD#PBF chip provides ±15kV ESD protection on the bus pins, safeguarding against electrostatic discharge events.Application Scenarios: 1. Industrial Automation: The LTC2875HDD#PBF chip is commonly used in industrial automation systems where reliable and high-speed communication is required. It can be used for connecting sensors, actuators, and other devices over long distances using the RS485/RS422 interface. 2. Building Automation: In building automation systems, the chip can be used for communication between various subsystems such as HVAC (Heating, Ventilation, and Air Conditioning), lighting control, security systems, etc. 3. Instrumentation and Measurement: The high-speed capabilities of the LTC2875HDD#PBF chip make it suitable for instrumentation and measurement applications where accurate and fast data acquisition is required. 4. Automotive Electronics: The chip's robustness and overvoltage protection make it suitable for automotive applications, such as communication between different electronic control units (ECUs) in a vehicle. 5. Renewable Energy Systems: The LTC2875HDD#PBF chip can be used in renewable energy systems, such as solar power plants or wind farms, for communication between various components and monitoring systems.These are just a few examples of the advantages and application scenarios of the LTC2875HDD#PBF chip. Its versatility, high-speed capabilities, and robustness make it suitable for a wide range of industrial and electronic applications.
LTC2875HDD#PBF Relevant information