LTC1481CS8#PBF

LTC1481CS8#PBF

Manufacturer No:

LTC1481CS8#PBF

Manufacturer:

Analog Devices Inc.

Description:

IC TRANSCEIVER HALF 1/1 8SO

Datasheet:

Datasheet

Delivery:

Payment:

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LTC1481CS8#PBF Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SO
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    4.75V ~ 5.25V
  • Data Rate
    2.5Mbps
  • Receiver Hysteresis
    45 mV
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The LTC1481CS8#PBF is a specific integrated circuit (IC) chip manufactured by Linear Technology (now part of Analog Devices). However, as an AI language model, I don't have access to real-time information about specific products or their latest features. My training only goes up until March 2023, so I may not have information on the LTC1481CS8#PBF specifically.In general, IC chips like the LTC1481CS8#PBF are used in various applications across different industries. Advantages of IC chips can include:1. Integration: IC chips often combine multiple functions or components into a single package, reducing the need for external components and simplifying circuit design.2. Size and Space Efficiency: IC chips are typically compact, allowing for miniaturization of electronic devices and efficient use of space on circuit boards.3. Power Efficiency: Many IC chips are designed to operate with low power consumption, making them suitable for battery-powered devices or energy-efficient applications.4. Performance and Reliability: IC chips are engineered to provide reliable and consistent performance, often with built-in protection features to enhance reliability.As for the specific application scenarios of the LTC1481CS8#PBF, it would be best to refer to the datasheet or technical documentation provided by the manufacturer. These documents typically outline the chip's features, specifications, and recommended applications.