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MAX3077EESA+T

MAX3077EESA+T

Manufacturer No:

MAX3077EESA+T

Description:

IC TRANSCEIVER FULL 1/1 8SOIC

Datasheet:

Datasheet

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MAX3077EESA+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Data Rate
    16Mbps
  • Receiver Hysteresis
    100 mV
  • Duplex
    Full
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MAX3077EESA+T is an integrated circuit chip manufactured by Maxim Integrated. It is specifically designed for use in industrial applications that require robust communication over long distances. Here are some advantages and application scenarios of the MAX3077EESA+T:Advantages: 1. Robust Communication: The MAX3077EESA+T chip provides robust communication by implementing differential signaling, which helps in reducing noise and improving signal integrity. 2. Long-Distance Communication: It supports long-distance communication up to several kilometers, making it suitable for applications that require communication over extended distances. 3. ESD Protection: The chip offers built-in electrostatic discharge (ESD) protection, safeguarding the circuitry from damage caused by static electricity. 4. Low Power Consumption: The MAX3077EESA+T is designed to operate with low power consumption, making it suitable for battery-powered applications.Application Scenarios: 1. Industrial Automation: The chip can be used in industrial automation systems, such as factory automation, process control, and robotics, where reliable and long-distance communication is required. 2. Building Automation: It can be employed in building automation systems for applications like HVAC (Heating, Ventilation, and Air Conditioning) control, lighting control, and security systems. 3. Remote Monitoring: The MAX3077EESA+T chip can be utilized in remote monitoring systems, such as environmental monitoring, energy management, and remote sensing, where data needs to be transmitted over long distances. 4. Smart Grids: It can be integrated into smart grid systems to enable reliable communication between various components, such as smart meters, substations, and control centers.It's important to note that the specific application and implementation of the MAX3077EESA+T chip may vary depending on the requirements of the system and the expertise of the designer.
MAX3077EESA+T Relevant information