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MAX3075EESA+T

MAX3075EESA+T

Manufacturer No:

MAX3075EESA+T

Description:

IC TRANSCEIVER HALF 1/1 8SOIC

Datasheet:

Datasheet

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MAX3075EESA+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Data Rate
    500kbps
  • Receiver Hysteresis
    100 mV
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MAX3075EESA+T is an integrated circuit chip designed for use in industrial control systems and automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. Robust and reliable: The MAX3075EESA+T is designed to withstand harsh industrial environments and is highly resistant to electromagnetic interference (EMI) and electrostatic discharge (ESD). 2. High-speed communication: This chip supports the ISO 11898 standard for high-speed CAN (Controller Area Network) communication, allowing for efficient data transmission in industrial and automotive systems. 3. Low power consumption: The chip is designed to operate at low power levels, making it suitable for battery-powered applications or energy-efficient systems. 4. High integration: The MAX3075EESA+T integrates several functionalities into a single chip, reducing system complexity and board space requirements.Application scenarios: 1. Industrial automation: The chip can be used in industrial control systems, such as factory automation, process control, and robotics, to enable reliable and fast communication between different nodes in the system. 2. Automotive electronics: The MAX3075EESA+T is suitable for automotive applications that require high-speed communication, such as electronic control units (ECUs), CAN bus systems, and vehicle diagnostics. 3. Energy management systems: The chip can be used in smart grid systems, solar inverters, or battery management systems, where reliable and low-power communication is crucial for efficient energy management. 4. Home automation: The chip can be utilized in home automation devices, like smart lighting systems or HVAC (heating, ventilation, and air conditioning) control, to enable seamless communication between different devices. 5. Medical devices: The MAX3075EESA+T can be used in medical instruments or monitoring devices that require secure and reliable communication between various components.Overall, the MAX3075EESA+T integrated circuit chip offers robustness, high-speed communication, low power consumption, and integration, making it suitable for a wide range of industrial and automotive applications.
MAX3075EESA+T Relevant information