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LTC2875HDD#TRPBF

LTC2875HDD#TRPBF

Manufacturer No:

LTC2875HDD#TRPBF

Manufacturer:

Analog Devices Inc.

Description:

IC TRANSCEIVER 1/1 8DFN

Datasheet:

Datasheet

Delivery:

Payment:

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LTC2875HDD#TRPBF Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-DFN (3x3)
  • Package / Case
    8-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    3V ~ 3.6V, 4.5V ~ 5.5V
  • Data Rate
    4Mbps
  • Duplex
    -
  • Number of Drivers/Receivers
    1/1
  • Protocol
    CANbus
  • Type
    Transceiver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The LTC2875HDD#TRPBF integrated circuit chips offer several advantages and are suitable for various application scenarios. Here are some of the advantages and application scenarios:Advantages: 1. High Performance: The LTC2875HDD#TRPBF chips provide excellent performance with low quiescent current, low operating voltage, and a wide supply voltage range. 2. Robustness: These chips offer robust protection features, including short-circuit and thermal protection, making them suitable for harsh operating conditions. 3. Flexible Interface: They support various interface options, such as RS485, RS422, and RS232, enabling seamless communication with different devices. 4. Wide Temperature Range: These chips can operate over a wide temperature range, making them suitable for both industrial and automotive applications. 5. Small Form Factor: They are available in small and compact packages, which helps in space-constrained applications.Application Scenarios: 1. Industrial Automation: The LTC2875HDD#TRPBF chips can be used in industrial automation systems that require reliable and high-speed communication between different devices, such as sensors, actuators, and controllers. 2. Automotive Electronics: Due to their robustness and wide operating temperature range, these chips can be employed in automotive applications that involve communication between different electronic systems within a vehicle. 3. Energy Management Systems: These chips can be utilized in energy management systems, such as smart grid infrastructure, solar power inverters, and battery management systems, where they can enable efficient and reliable communication. 4. Building Automation: The LTC2875HDD#TRPBF chips are suitable for building automation systems, including HVAC (heating, ventilation, and air conditioning), access control, and lighting control, where they can facilitate seamless communication between various subsystems. 5. Medical Devices: Due to their low power consumption, small form factor, and reliable communication capabilities, these chips can be employed in various medical devices like patient monitoring systems, medical imaging equipment, and laboratory instruments.It's important to note that the specific application scenarios may vary based on the exact requirements and design considerations of each use case.
LTC2875HDD#TRPBF Relevant information