ISL3179EIBZ

ISL3179EIBZ

Manufacturer No:

ISL3179EIBZ

Description:

IC TRANSCEIVER HALF 1/1 8SOIC

Datasheet:

Datasheet

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ISL3179EIBZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    3V ~ 3.6V
  • Data Rate
    40Mbps
  • Receiver Hysteresis
    28 mV
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The ISL3179EIBZ is an integrated circuit chip that belongs to the ISL3179xE family of devices. These chips are designed for use in industrial applications that require robust communication interfaces. Here are some advantages and application scenarios of the ISL3179EIBZ:Advantages: 1. Robust Communication: The ISL3179EIBZ chip provides robust communication capabilities, making it suitable for industrial environments with high levels of electrical noise and harsh conditions. 2. High-Speed Data Transfer: It supports high-speed data transfer rates up to 40 Mbps, enabling fast and efficient communication between devices. 3. ESD Protection: The chip offers built-in electrostatic discharge (ESD) protection, safeguarding the communication interface from potential damage caused by static electricity. 4. Low Power Consumption: The ISL3179EIBZ chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.Application Scenarios: 1. Industrial Automation: The ISL3179EIBZ chip is commonly used in industrial automation systems, such as programmable logic controllers (PLCs), motor control systems, and industrial sensors. It enables reliable and high-speed communication between various components in these systems. 2. Process Control: In process control applications, the ISL3179EIBZ chip can be used to establish communication links between different control devices, such as distributed control systems (DCS), supervisory control and data acquisition (SCADA) systems, and field instruments. 3. Building Automation: The chip can be employed in building automation systems to facilitate communication between different subsystems, including HVAC (heating, ventilation, and air conditioning), lighting control, and security systems. 4. Smart Grids: The ISL3179EIBZ chip can be utilized in smart grid applications, enabling reliable communication between smart meters, distribution automation devices, and energy management systems.It's important to note that the specific application of the ISL3179EIBZ chip may vary depending on the requirements of the system and the design choices made by the engineers implementing it.