Home / Audio Special Purpose / ZL38090LDF1/
ZL38090LDF1

ZL38090LDF1

Manufacturer No:

ZL38090LDF1

Manufacturer:

Description:

IC AUDIO PROCESSOR 64QFN

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

ZL38090LDF1 Specifications

  • Type
    Parameter
  • Package / Case
    64-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Number of Channels
    4
  • Function
    Audio Processor
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    -
The ZL38090LDF1 integrated circuit chip is a highly versatile and advanced audio processing solution. Some of its advantages and application scenarios include:1. Advanced Audio Processing: The ZL38090LDF1 chip offers advanced audio processing capabilities, including acoustic echo cancellation, noise reduction, and beamforming. This makes it suitable for applications that require high-quality audio processing, such as conference systems, smart speakers, and voice-enabled devices.2. Multi-Microphone Array Support: The chip supports multiple microphones, allowing for the implementation of microphone arrays. This enables applications like voice recognition, voice command systems, and far-field voice pickup, where accurate sound localization and noise suppression are crucial.3. Low Power Consumption: The ZL38090LDF1 chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is essential.4. Flexible Configuration: The chip offers flexible configuration options, allowing developers to customize the audio processing algorithms and parameters according to their specific requirements. This flexibility makes it suitable for a wide range of applications, from consumer electronics to industrial and automotive applications.5. Integrated Digital Signal Processor (DSP): The chip includes an integrated DSP, which enables real-time audio processing and reduces the need for external processing components. This integration simplifies the design process and reduces the overall system cost.6. Wide Compatibility: The ZL38090LDF1 chip is compatible with various audio interfaces, including I2S, TDM, and PDM. This compatibility allows for easy integration into existing audio systems and makes it suitable for a wide range of applications.Overall, the ZL38090LDF1 integrated circuit chip offers advanced audio processing capabilities, low power consumption, and flexible configuration options, making it suitable for applications such as conference systems, smart speakers, voice-enabled devices, and more.
ZL38090LDF1 Relevant information