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XC17S30ASO20C

XC17S30ASO20C

Manufacturer No:

XC17S30ASO20C

Manufacturer:

AMD

Description:

IC PROM SER 30000 C-TEMP 20-SOIC

Datasheet:

Datasheet

Delivery:

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XC17S30ASO20C Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3V ~ 3.6V
  • Memory Size
    300kb
  • Programmable Type
    OTP
  • DigiKey Programmable
    Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XC17S30ASO20C is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the XC17S series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of the XC17S30ASO20C IC chip:Advantages: 1. High-density programmable logic: The XC17S30ASO20C offers a high logic density, allowing for the implementation of complex digital circuits on a single chip. 2. Flexibility: Being an FPGA, the XC17S30ASO20C can be reprogrammed multiple times, making it suitable for prototyping and development purposes. 3. Fast configuration: The chip supports fast configuration times, enabling quick system startup and reconfiguration. 4. Low power consumption: The XC17S30ASO20C is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 5. High-speed performance: The chip supports high-speed operation, making it suitable for applications that require fast data processing and high-performance computing.Application scenarios: 1. Digital signal processing (DSP): The XC17S30ASO20C can be used in DSP applications such as audio and video processing, image recognition, and telecommunications. 2. Embedded systems: The chip can be utilized in embedded systems for various applications, including industrial automation, robotics, and automotive electronics. 3. Communications: The XC17S30ASO20C can be used in networking equipment, routers, switches, and other communication devices that require high-speed data processing and low latency. 4. Aerospace and defense: The chip's high-density programmable logic and low power consumption make it suitable for aerospace and defense applications, including avionics, radar systems, and secure communications. 5. Consumer electronics: The XC17S30ASO20C can be used in consumer electronics such as gaming consoles, set-top boxes, and high-definition televisions for advanced processing and multimedia capabilities.It's important to note that the specific application scenarios may vary depending on the requirements and design choices made by the system designer.
XC17S30ASO20C Relevant information