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XC17S10XLPD8I

XC17S10XLPD8I

Manufacturer No:

XC17S10XLPD8I

Manufacturer:

AMD

Description:

IC PROM PROG I-TEMP 3.3V 8-DIP

Datasheet:

Datasheet

Delivery:

Payment:

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XC17S10XLPD8I Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-PDIP
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Memory Size
    100kb
  • Programmable Type
    OTP
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XC17S10XLPD8I is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the XC17S series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High-density programmable logic: The XC17S10XLPD8I offers a high-density programmable logic array, allowing for complex digital designs to be implemented on a single chip. 2. Flexibility: Being an FPGA, it provides the flexibility to reprogram the chip even after it has been manufactured, enabling design changes and updates without the need for physical modifications. 3. Fast prototyping: FPGAs like the XC17S10XLPD8I are commonly used for rapid prototyping of digital systems, as they allow for quick design iterations and testing. 4. Low power consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 5. High-speed performance: The XC17S10XLPD8I offers high-speed performance, allowing for the implementation of designs that require fast data processing or real-time operations.Application scenarios: 1. Digital signal processing (DSP): The XC17S10XLPD8I can be used in DSP applications such as audio and video processing, image recognition, or wireless communication systems. 2. Embedded systems: It can be utilized in embedded systems where programmable logic is required, such as industrial automation, robotics, or automotive electronics. 3. Communication systems: The chip can be used in the development of communication systems like routers, switches, or network interface cards, where high-speed data processing and flexibility are essential. 4. Test and measurement equipment: The XC17S10XLPD8I can be employed in test and measurement equipment, providing the ability to implement custom test algorithms or signal processing functions. 5. Aerospace and defense: Due to its high-density programmable logic and low power consumption, this chip can be used in aerospace and defense applications, including avionics, radar systems, or secure communication systems.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of a particular project.
XC17S10XLPD8I Relevant information