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XC17S30XLPDG8C

XC17S30XLPDG8C

Manufacturer No:

XC17S30XLPDG8C

Manufacturer:

AMD

Description:

IC PROM PROG C-TEMP 3.3V 8-DIP

Datasheet:

Datasheet

Delivery:

Payment:

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XC17S30XLPDG8C Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-PDIP
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3V ~ 3.6V
  • Memory Size
    300kb
  • Programmable Type
    OTP
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XC17S30XLPDG8C is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the XC17S series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of the XC17S30XLPDG8C IC chips:Advantages: 1. High-density programmable logic: The XC17S30XLPDG8C offers a high-density programmable logic array, allowing for complex digital designs to be implemented on a single chip. 2. Flexibility: Being an FPGA, the XC17S30XLPDG8C provides flexibility in terms of design modifications and updates. It can be reprogrammed multiple times to accommodate changing requirements. 3. Fast prototyping: FPGAs like the XC17S30XLPDG8C are often used for rapid prototyping of digital systems. They enable quick design iterations and testing, reducing time to market. 4. Low power consumption: The XC17S30XLPDG8C is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. High-speed performance: With advanced circuitry and optimized architecture, the XC17S30XLPDG8C can operate at high clock frequencies, enabling fast data processing.Application scenarios: 1. Digital signal processing (DSP): The XC17S30XLPDG8C can be used in DSP applications such as audio and video processing, image recognition, and communication systems. 2. Embedded systems: It can be employed in embedded systems for various applications like industrial automation, robotics, automotive electronics, and medical devices. 3. Communications: The XC17S30XLPDG8C can be utilized in networking equipment, routers, switches, and other communication devices that require high-speed data processing and low latency. 4. Aerospace and defense: FPGAs are commonly used in aerospace and defense applications due to their ability to handle complex algorithms, encryption, and real-time data processing. 5. Research and development: The XC17S30XLPDG8C can be used in research and development projects where flexible and reconfigurable hardware is required for experimentation and testing.It's important to note that the specific application scenarios may vary depending on the requirements and capabilities of the XC17S30XLPDG8C IC chip.
XC17S30XLPDG8C Relevant information