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XC17S200APDG8I

XC17S200APDG8I

Manufacturer No:

XC17S200APDG8I

Manufacturer:

AMD

Description:

IC PROM SER 200K I-TEMP 8-DIP

Datasheet:

Datasheet

Delivery:

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XC17S200APDG8I Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-PDIP
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Programmable Type
    OTP
  • DigiKey Programmable
    Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XC17S200APDG8I is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the XC17S series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of the XC17S200APDG8I IC chip:Advantages: 1. High-density programmable logic: The XC17S200APDG8I offers a high-density programmable logic array, allowing for the implementation of complex digital circuits and systems. 2. Flexibility: Being an FPGA, the chip offers flexibility in terms of reprogramming and reconfiguring the logic functions, making it suitable for prototyping and development of various applications. 3. Fast performance: The XC17S200APDG8I provides fast performance due to its high-speed internal architecture, making it suitable for applications that require quick response times. 4. Low power consumption: The chip is designed to consume low power, making it energy-efficient and suitable for battery-powered or low-power applications. 5. Small form factor: The XC17S200APDG8I is available in a small form factor, making it suitable for applications with space constraints.Application scenarios: 1. Digital signal processing (DSP): The XC17S200APDG8I can be used in DSP applications that require high-speed processing of digital signals, such as audio and video processing, image recognition, and communication systems. 2. Embedded systems: The chip can be used in embedded systems where programmable logic is required, such as industrial automation, robotics, and automotive applications. 3. Prototyping and development: The XC17S200APDG8I is commonly used in prototyping and development of digital circuits and systems, allowing engineers to test and validate their designs before manufacturing custom ASICs (Application-Specific Integrated Circuits). 4. Communication systems: The chip can be used in communication systems, including wireless communication, networking equipment, and data transmission applications. 5. Consumer electronics: The XC17S200APDG8I can be utilized in various consumer electronics devices, such as gaming consoles, set-top boxes, and multimedia devices, where programmable logic is required for customization and flexibility.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or application.
XC17S200APDG8I Relevant information