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DS1270AB-70

DS1270AB-70

Manufacturer No:

DS1270AB-70

Description:

IC NVSRAM 16MBIT PARALLEL 36EDIP

Datasheet:

Datasheet

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DS1270AB-70 Specifications

  • Type
    Parameter
  • Supplier Device Package
    36-EDIP
  • Package / Case
    36-DIP Module (0.610", 15.49mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    4.75V ~ 5.25V
  • Access Time
    70 ns
  • Write Cycle Time - Word, Page
    70ns
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 8
  • Memory Size
    16Mbit
  • Technology
    NVSRAM (Non-Volatile SRAM)
  • Memory Format
    NVSRAM
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DS1270AB-70 is a specific integrated circuit (IC) chip produced by Maxim Integrated. While it is difficult to find specific information about this chip, we can make some general assumptions about its advantages and possible application scenarios based on its naming convention and capabilities commonly found in IC chips.Advantages of DS1270AB-70 IC chips:1. High performance: The chip is likely to offer high-speed operations and precise functionality, allowing for efficient processing and control.2. Low power consumption: It may have power-saving features to reduce energy consumption, making it suitable for battery-powered devices or low-power applications.3. Compact size: Being an integrated circuit chip, it is small and can fit into compact electronic devices, making it ideal for designs with limited space.4. Robustness: It might possess robust features like ESD (electrostatic discharge) protection or resistance to various environmental conditions, ensuring reliable and durable performance.Application scenarios of DS1270AB-70 IC chips:1. Consumer electronics: The chip may find applications in various consumer electronic devices, such as smartphones, tablets, digital cameras, or wearable technology, due to its compact size and suitable performance characteristics.2. Industrial automation: It could be used in automation systems or industrial equipment that require precise control, data processing, and communication capabilities.3. Automotive electronics: The chip might be utilized in automotive applications, such as engine control units, transmission systems, or infotainment systems, where high performance and reliability are crucial.4. Internet of Things (IoT): Given its potential low power consumption and compact size, the chip may be suitable for IoT devices that require seamless connectivity, sensor integration, and efficient processing.Note: Since the specific details of the DS1270AB-70 chip are not available, the mentioned advantages and application scenarios are based on assumptions and general knowledge about integrated circuit chips. It is always recommended to refer to the manufacturer's documentation or datasheet for accurate information.
DS1270AB-70 Relevant information