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DS1345WP-100IND

DS1345WP-100IND

Manufacturer No:

DS1345WP-100IND

Description:

IC NVSRAM 1MBIT PAR 34PWRCAP

Datasheet:

Datasheet

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DS1345WP-100IND Specifications

  • Type
    Parameter
  • Supplier Device Package
    34-PowerCap Module
  • Package / Case
    34-PowerCap™ Module
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    3V ~ 3.6V
  • Access Time
    100 ns
  • Write Cycle Time - Word, Page
    100ns
  • Memory Interface
    Parallel
  • Memory Organization
    128K x 8
  • Memory Size
    1Mbit
  • Technology
    NVSRAM (Non-Volatile SRAM)
  • Memory Format
    NVSRAM
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DS1345WP-100IND is a specific integrated circuit chip manufactured by Maxim Integrated. While I don't have access to the specific datasheet for this chip, I can provide you with some general information about integrated circuits and their advantages and application scenarios.Integrated circuits (ICs) are miniature electronic circuits that are fabricated onto a small semiconductor chip. They contain a large number of electronic components, such as transistors, resistors, and capacitors, all integrated into a single package. ICs offer several advantages over discrete electronic components:1. Size and Space Efficiency: ICs allow for the miniaturization of electronic circuits, enabling complex functionality in a small form factor. This makes them ideal for applications where space is limited, such as in portable devices or densely packed electronic systems.2. Power Efficiency: Integrated circuits are designed to be power-efficient, allowing for longer battery life in portable devices and reducing power consumption in larger systems. This is achieved through optimized circuit design and the use of low-power components.3. Reliability: ICs are manufactured using advanced fabrication techniques, resulting in consistent and reliable performance. The integration of components onto a single chip also reduces the number of interconnections, minimizing the risk of failure due to loose connections or environmental factors.4. Cost-Effectiveness: While the initial development and manufacturing costs of ICs can be high, their mass production and economies of scale make them cost-effective in the long run. Additionally, the integration of multiple components onto a single chip reduces the need for additional components, simplifying the overall system design.As for the application scenarios of the DS1345WP-100IND chip, it would be best to refer to the datasheet or technical documentation provided by Maxim Integrated. The datasheet typically outlines the specific features, functionalities, and recommended applications for the chip. It may include information on its compatibility with different communication protocols, voltage requirements, and other relevant specifications.By referring to the datasheet, you can gain a better understanding of the DS1345WP-100IND's capabilities and determine its suitability for your specific application.
DS1345WP-100IND Relevant information