Home / Memory / DS1245YP-70IND/
DS1245YP-70IND

DS1245YP-70IND

Manufacturer No:

DS1245YP-70IND

Description:

IC NVSRAM 1MBIT PAR 34PWRCAP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

DS1245YP-70IND Specifications

  • Type
    Parameter
  • Supplier Device Package
    34-PowerCap Module
  • Package / Case
    34-PowerCap™ Module
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Access Time
    70 ns
  • Write Cycle Time - Word, Page
    70ns
  • Memory Interface
    Parallel
  • Memory Organization
    128K x 8
  • Memory Size
    1Mbit
  • Technology
    NVSRAM (Non-Volatile SRAM)
  • Memory Format
    NVSRAM
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DS1245YP-70IND is a specific integrated circuit (IC) chip manufactured by Maxim Integrated. While I don't have access to the specific details of this chip, I can provide you with some general information about IC chips and their advantages and application scenarios.Integrated circuit chips offer several advantages over traditional discrete electronic components. Here are a few key advantages:1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to significant size reduction. This miniaturization enables the creation of smaller and more compact electronic devices.2. Improved Performance: By integrating multiple components onto a single chip, ICs can provide improved performance compared to discrete components. The close proximity of components reduces signal loss and improves overall system efficiency.3. Cost-Effectiveness: IC chips can be mass-produced, leading to economies of scale and reduced manufacturing costs. This makes them more cost-effective compared to assembling individual discrete components.4. Reliability: The integration of components onto a single chip reduces the number of interconnections, minimizing the risk of loose connections or failures due to environmental factors such as temperature and vibration.Regarding the application scenarios of the DS1245YP-70IND chip, it is important to note that specific IC chips are designed for specific purposes. Without detailed information about this particular chip, it is challenging to provide precise application scenarios. However, IC chips are used in a wide range of electronic devices and systems, including:1. Consumer Electronics: IC chips are commonly found in smartphones, tablets, televisions, gaming consoles, and other consumer electronic devices.2. Automotive Electronics: IC chips are used in various automotive applications, such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).3. Industrial Control Systems: IC chips are utilized in industrial automation, robotics, and control systems to enable precise control and monitoring of processes.4. Medical Devices: IC chips play a crucial role in medical devices, including diagnostic equipment, patient monitoring systems, and implantable devices.5. Communication Systems: IC chips are used in networking equipment, wireless communication devices, and satellite systems to enable data transmission and reception.It's important to consult the datasheet or technical documentation provided by the manufacturer to obtain detailed information about the DS1245YP-70IND chip and its specific advantages and application scenarios.
DS1245YP-70IND Relevant information