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DS1245ABP-70

DS1245ABP-70

Manufacturer No:

DS1245ABP-70

Description:

IC NVSRAM 1MBIT PAR 34PWRCAP

Datasheet:

Datasheet

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DS1245ABP-70 Specifications

  • Type
    Parameter
  • Supplier Device Package
    34-PowerCap Module
  • Package / Case
    34-PowerCap™ Module
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    4.75V ~ 5.25V
  • Access Time
    70 ns
  • Write Cycle Time - Word, Page
    70ns
  • Memory Interface
    Parallel
  • Memory Organization
    128K x 8
  • Memory Size
    1Mbit
  • Technology
    NVSRAM (Non-Volatile SRAM)
  • Memory Format
    NVSRAM
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DS1245ABP-70 is a specific integrated circuit (IC) chip manufactured by Maxim Integrated. While I don't have access to the specific datasheet for this chip, I can provide you with some general information about IC chips and their advantages and application scenarios.Integrated circuit chips, also known as ICs or microchips, are small electronic devices that contain a large number of interconnected electronic components, such as transistors, resistors, and capacitors, on a single semiconductor substrate. They are widely used in various electronic devices and systems due to their compact size, reliability, and performance advantages.Advantages of IC chips include:1. Miniaturization: IC chips allow for the integration of a large number of electronic components onto a single chip, enabling miniaturization of electronic devices and systems. This is particularly beneficial in applications where space is limited, such as in portable devices or embedded systems.2. Improved performance: IC chips can provide improved performance compared to discrete components. The integration of components on a single chip reduces parasitic effects and improves signal integrity, leading to better overall performance.3. Cost-effectiveness: Mass production of IC chips can lead to cost savings compared to using individual discrete components. Additionally, IC chips often require less power and generate less heat, resulting in lower operating costs.4. Reliability: IC chips are generally more reliable than discrete components since they are manufactured in controlled environments and undergo rigorous testing. The integration of components on a single chip also reduces the number of interconnections, minimizing the risk of failures due to loose connections.As for the application scenarios of the DS1245ABP-70 chip, it is important to refer to the specific datasheet or technical documentation provided by Maxim Integrated. The datasheet will outline the chip's features, specifications, and recommended applications. It is common for IC chips to have a wide range of potential applications, including but not limited to:1. Memory storage: Many IC chips are designed for memory storage applications, such as non-volatile memory (NVM) chips used for data storage in various electronic devices.2. Embedded systems: IC chips are commonly used in embedded systems, which are specialized computer systems designed for specific tasks or applications. These systems can be found in automotive electronics, industrial control systems, medical devices, and more.3. Communication systems: IC chips play a crucial role in communication systems, including wireless communication, networking equipment, and telecommunications devices.4. Consumer electronics: IC chips are extensively used in consumer electronics, such as smartphones, tablets, digital cameras, and gaming consoles.Remember, for detailed information about the DS1245ABP-70 chip, it is best to consult the datasheet or reach out to Maxim Integrated for specific application scenarios and advantages of this particular chip.
DS1245ABP-70 Relevant information