DS1330ABP-70IND

DS1330ABP-70IND

Manufacturer No:

DS1330ABP-70IND

Description:

IC NVSRAM 256KBIT PAR 34PWRCAP

Datasheet:

Datasheet

Delivery:

Payment:

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DS1330ABP-70IND Specifications

  • Type
    Parameter
  • Supplier Device Package
    34-PowerCap Module
  • Package / Case
    34-PowerCap™ Module
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.75V ~ 5.25V
  • Access Time
    70 ns
  • Write Cycle Time - Word, Page
    70ns
  • Memory Interface
    Parallel
  • Memory Organization
    32K x 8
  • Memory Size
    256Kbit
  • Technology
    NVSRAM (Non-Volatile SRAM)
  • Memory Format
    NVSRAM
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DS1330ABP-70IND is a specific integrated circuit chip, and without detailed information about its specifications and features, it is challenging to provide a comprehensive analysis of its advantages and application scenarios. However, I can provide you with some general information about integrated circuit chips and their potential advantages and applications.Integrated circuit chips, also known as IC chips or microchips, are miniaturized electronic circuits that contain various components such as transistors, resistors, capacitors, and diodes. These components are fabricated onto a small semiconductor wafer, typically made of silicon. IC chips are widely used in various electronic devices and systems due to their compact size, low power consumption, and high reliability.Advantages of integrated circuit chips:1. Miniaturization: IC chips allow complex electronic circuits to be packed into a small form factor, enabling the development of smaller and more portable devices.2. Power efficiency: Integrated circuits are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications.3. Reliability: The miniaturized components on IC chips are manufactured using advanced fabrication techniques, resulting in improved reliability and reduced failure rates.4. Cost-effectiveness: Mass production of IC chips leads to economies of scale, making them cost-effective for various applications.Application scenarios of integrated circuit chips:1. Consumer electronics: IC chips are extensively used in smartphones, tablets, laptops, televisions, and other consumer electronic devices to perform various functions such as processing, memory storage, and wireless communication.2. Automotive industry: Integrated circuits are crucial components in modern vehicles, controlling functions like engine management, safety systems, entertainment systems, and navigation.3. Industrial automation: IC chips are employed in industrial automation systems for tasks such as control, monitoring, and data processing in manufacturing plants, robotics, and process control systems.4. Medical devices: Integrated circuits play a vital role in medical devices like pacemakers, insulin pumps, and diagnostic equipment, enabling precise control and accurate measurements.5. Communication systems: IC chips are used in telecommunications infrastructure, networking equipment, and wireless devices to facilitate data transmission, signal processing, and network management.It's important to note that the specific advantages and application scenarios of the DS1330ABP-70IND integrated circuit chip may vary depending on its intended purpose and design. To gain a more detailed understanding of this particular chip, it would be best to refer to its datasheet or consult the manufacturer's documentation.