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DS1330YP-70

DS1330YP-70

Manufacturer No:

DS1330YP-70

Description:

IC NVSRAM 256KBIT PAR 34PWRCAP

Datasheet:

Datasheet

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DS1330YP-70 Specifications

  • Type
    Parameter
  • Supplier Device Package
    34-PowerCap Module
  • Package / Case
    34-PowerCap™ Module
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Access Time
    70 ns
  • Write Cycle Time - Word, Page
    70ns
  • Memory Interface
    Parallel
  • Memory Organization
    32K x 8
  • Memory Size
    256Kbit
  • Technology
    NVSRAM (Non-Volatile SRAM)
  • Memory Format
    NVSRAM
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DS1330YP-70 is a specific integrated circuit chip manufactured by Maxim Integrated. While I don't have access to the specific datasheet for this chip, I can provide you with some general information about integrated circuits and their potential advantages and application scenarios.Integrated circuits (ICs) are miniature electronic circuits that are fabricated onto a small semiconductor chip. They contain a combination of active and passive electronic components, such as transistors, resistors, capacitors, and diodes, all integrated onto a single chip. ICs offer several advantages over discrete electronic components:1. Size and Space Efficiency: ICs allow for the integration of multiple components onto a single chip, reducing the overall size and complexity of electronic systems. This makes them ideal for applications where space is limited, such as in portable devices or densely packed electronic systems.2. Power Efficiency: Integrated circuits can be designed to operate at lower power levels, resulting in improved energy efficiency. This is particularly important in battery-powered devices where power consumption needs to be minimized.3. Reliability: The integration of components onto a single chip reduces the number of interconnections, which can improve the overall reliability of the circuit. Additionally, ICs are often manufactured using advanced fabrication techniques, resulting in higher quality and more reliable components.4. Cost-Effectiveness: Mass production of integrated circuits can lead to significant cost reductions compared to discrete components. This makes ICs a cost-effective solution for many electronic applications.As for the specific application scenarios of the DS1330YP-70 chip, without access to the datasheet, it is challenging to provide precise details. However, integrated circuits can be used in a wide range of applications, including:- Consumer Electronics: ICs are commonly used in devices such as smartphones, tablets, digital cameras, and audio/video equipment.- Automotive Electronics: Integrated circuits are extensively used in automotive systems, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).- Industrial Control Systems: ICs play a crucial role in various industrial applications, such as process control, robotics, and automation.- Communication Systems: Integrated circuits are used in telecommunications equipment, networking devices, and wireless communication systems.- Medical Devices: ICs are employed in medical equipment, such as patient monitoring systems, imaging devices, and implantable devices.It's important to note that the specific application scenarios of the DS1330YP-70 chip may depend on its features, specifications, and intended purpose, which can be found in the datasheet provided by the manufacturer.
DS1330YP-70 Relevant information