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MT53E768M32D4DT-046 WT:E

MT53E768M32D4DT-046 WT:E

Manufacturer No:

MT53E768M32D4DT-046 WT:E

Manufacturer:

Micron Technology Inc.

Description:

IC DRAM 24GBIT 2.133GHZ 200VFBGA

Datasheet:

Datasheet

Delivery:

Payment:

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MT53E768M32D4DT-046 WT:E Specifications

  • Type
    Parameter
  • Supplier Device Package
    200-VFBGA (10x14.5)
  • Package / Case
    200-VFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TC)
  • Voltage - Supply
    1.1V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    2.133 GHz
  • Memory Interface
    -
  • Memory Organization
    768M x 32
  • Memory Size
    24Gbit
  • Technology
    SDRAM - Mobile LPDDR4
  • Memory Format
    DRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The MT53E768M32D4DT-046 WT:E integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Density: These chips offer a high memory density of 8Gb (gigabits), allowing for the storage of large amounts of data in a compact form factor. 2. High Speed: The chips support high-speed data transfer rates, enabling faster processing and data access. 3. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 4. Wide Temperature Range: The chips can operate reliably across a wide temperature range, making them suitable for use in harsh environments. 5. High Reliability: These chips are built with advanced technology and undergo rigorous testing, ensuring high reliability and long-term performance.Application Scenarios: 1. Mobile Devices: The high density and low power consumption make these chips suitable for use in smartphones, tablets, and other mobile devices, where space and power efficiency are crucial. 2. Automotive Electronics: The wide temperature range and high reliability make these chips suitable for automotive applications, such as infotainment systems, advanced driver-assistance systems (ADAS), and in-vehicle networking. 3. Industrial Applications: The chips can be used in industrial automation, robotics, and control systems, where high-speed data processing and reliability are essential. 4. Networking and Data Centers: These chips can be used in networking equipment, servers, and data centers to provide high-speed and high-capacity memory for data storage and processing. 5. IoT (Internet of Things) Devices: The low power consumption and high density make these chips suitable for IoT devices, such as wearables, smart home devices, and sensors, where power efficiency and compact size are important.Overall, the MT53E768M32D4DT-046 WT:E integrated circuit chips offer high density, high speed, low power consumption, and wide temperature range, making them versatile for various applications in mobile devices, automotive electronics, industrial systems, networking, and IoT devices.
MT53E768M32D4DT-046 WT:E Relevant information