71V65803S150BG8
Manufacturer No:
71V65803S150BG8
Manufacturer:
Description:
IC SRAM 9MBIT PAR 150MHZ 119PBGA
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71V65803S150BG8 Specifications
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TypeParameter
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Supplier Device Package119-PBGA (14x22)
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Package / Case119-BGA
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C (TA)
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Voltage - Supply3.135V ~ 3.465V
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Access Time3.8 ns
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Write Cycle Time - Word, Page-
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Clock Frequency150 MHz
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Memory InterfaceParallel
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Memory Organization512K x 18
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Memory Size9Mbit
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TechnologySRAM - Synchronous, SDR (ZBT)
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Memory FormatSRAM
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Memory TypeVolatile
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DigiKey ProgrammableNot Verified
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The 71V65803S150BG8 is a specific integrated circuit chip with various capabilities and advantages. Here are some of its advantages and potential application scenarios:Advantages: 1. High Density: The chip has a high-density architecture, which allows it to accommodate a large amount of data and functions in a compact package. This makes it suitable for applications requiring high storage capacity. 2. Low Power Consumption: The chip is designed to operate with low power consumption, which helps in reducing overall energy usage and extending battery life in portable devices. 3. Fast Access Time: With a fast access time, the chip enables quick retrieval and processing of data, making it appropriate for applications requiring real-time access to information. 4. Wide Temperature Range: The chip is built to operate reliably across a wide temperature range, making it applicable in both industrial and consumer electronics environments.Application Scenarios: 1. Memory Modules: The 71V65803S150BG8 chip can be used in memory modules such as RAM (Random Access Memory) or Flash memory. Its high density allows for large storage capacities suitable for servers, data centers, and other high-performance computing systems. 2. Embedded Systems: Due to its low power consumption and fast access time, the chip is commonly utilized in embedded systems like smart appliances, industrial automation, IoT devices, and other applications where power efficiency and real-time performance are critical. 3. Telecommunications: The chip's high density and temperature range make it suitable for telecommunications applications. It can be used in networking equipment like routers, switches, and base stations to handle high-speed data processing and storage requirements. 4. Automotive Electronics: With the ability to operate at different temperatures, the chip finds applications in automotive electronics. It can be integrated into infotainment systems, vehicle diagnostics, and other automotive modules that require reliable and fast memory solutions.It is important to note that the specific implementation and application of the 71V65803S150BG8 chip may vary based on individual project requirements and system designs.
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