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AS4C512M16D3LA-10BCNTR

AS4C512M16D3LA-10BCNTR

Manufacturer No:

AS4C512M16D3LA-10BCNTR

Manufacturer:

Alliance Memory, Inc.

Description:

IC DRAM 8GBIT PAR 96FBGA

Datasheet:

Datasheet

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AS4C512M16D3LA-10BCNTR Specifications

  • Type
    Parameter
  • Access Time
    20 ns
  • Clock Frequency
    933 MHz
  • Memory Organization
    512M x 16
  • Supplier Device Package
    96-FBGA (13.5x9)
  • Package / Case
    96-TFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 95°C (TC)
  • Voltage - Supply
    1.283V ~ 1.45V
  • Write Cycle Time - Word, Page
    15ns
  • Memory Interface
    Parallel
  • Memory Size
    8Gbit
  • Technology
    SDRAM - DDR3L
  • Memory Format
    DRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The AS4C512M16D3LA-10BCNTR is a specific type of integrated circuit (IC) chip known as a synchronous dynamic random-access memory (SDRAM). Some of the advantages and application scenarios of this chip are as follows:Advantages: 1. High Capacity: The AS4C512M16D3LA-10BCNTR has a capacity of 512 megabits (64 megabytes) which allows for large amounts of data storage. 2. High Speed: With a clock speed of 10 nanoseconds (ns), the chip offers fast access times, enabling quick read and write operations. 3. Synchronous Operation: The chip uses a synchronous interface which synchronizes accesses to the memory with an external clock signal, resulting in efficient and predictable performance. 4. Low Power Consumption: The IC is designed to operate at low power levels, making it energy-efficient and suitable for power-constrained applications. 5. Compliant with Industry Standards: The AS4C512M16D3LA-10BCNTR chip conforms to JEDEC standards, ensuring compatibility with a wide range of systems and applications.Application Scenarios: 1. Computer Systems: The chip can be used in desktop and laptop computers as main memory (RAM) modules to enhance system performance and enable multitasking capabilities. 2. Embedded Systems: Due to its high capacity and speed, the IC is suitable for use in embedded systems like industrial automation, medical devices, and network equipment, where it can store and process data efficiently. 3. Servers and Data Centers: The chip is commonly employed in server and data center applications to provide the high-speed, high-capacity memory required for managing large amounts of data, running applications, and supporting virtualization. 4. Networking Equipment: For networking devices such as switches and routers, the chip can be used for buffering and caching data, ensuring smooth data transmission and reducing latency. 5. Consumer Electronics: Devices such as gaming consoles, set-top boxes, and televisions can benefit from the AS4C512M16D3LA-10BCNTR chip's capacity and speed, enabling faster data access and improving overall performance.It is important to note that the AS4C512M16D3LA-10BCNTR IC chip is just one option among many available in the market, and the specific advantages and application scenarios may vary depending on the requirements and specifications of a particular system or product.
AS4C512M16D3LA-10BCNTR Relevant information