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AS4C1G8D3LA-10BCNTR

AS4C1G8D3LA-10BCNTR

Manufacturer No:

AS4C1G8D3LA-10BCNTR

Manufacturer:

Alliance Memory, Inc.

Description:

IC DRAM 8GBIT PAR 78FBGA

Datasheet:

Datasheet

Delivery:

Payment:

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AS4C1G8D3LA-10BCNTR Specifications

  • Type
    Parameter
  • Access Time
    20 ns
  • Clock Frequency
    933 MHz
  • Memory Organization
    1G x 8
  • Supplier Device Package
    78-FBGA (9x10.5)
  • Package / Case
    78-TFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 95°C (TC)
  • Voltage - Supply
    1.283V ~ 1.45V
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Size
    8Gbit
  • Technology
    SDRAM - DDR3L
  • Memory Format
    DRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The AS4C1G8D3LA-10BCNTR integrated circuit chips offer several advantages and can be applied in various scenarios. Here are some key advantages and application scenarios:Advantages: 1. High Density: The AS4C1G8D3LA-10BCNTR chip has a density of 1 Gb (Gigabit), which means it can store a large amount of data in a compact form factor. 2. Low Power Consumption: This chip has low power requirements, making it suitable for devices with limited power capabilities or battery-powered devices. 3. High-Speed Operation: The AS4C1G8D3LA-10BCNTR chip operates at a high clock frequency, allowing for fast data processing and transfer. 4. Wide Temperature Range: These chips can operate reliably in a wide temperature range, making them suitable for industrial or automotive applications that may face extreme temperature conditions. 5. Easy Integration: The AS4C1G8D3LA-10BCNTR chip can be easily integrated into different electronic devices due to its compact form factor and compatibility with standard interfaces.Application Scenarios: 1. Mobile Devices: The high-density and low-power characteristics make these chips suitable for use in mobile phones, tablets, and other portable electronic devices, enabling high-performance and energy-efficient memory storage. 2. Computers and Servers: The AS4C1G8D3LA-10BCNTR chips can be used in computer systems, servers, and data centers to provide reliable and high-speed memory for various applications such as data storage, caching, and virtualization. 3. Automotive Electronics: With the ability to operate in a wide temperature range, these chips can be utilized in automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and telematics. 4. Industrial Systems: The AS4C1G8D3LA-10BCNTR chips are suitable for industrial applications, including robotics, factory automation, and control systems, where high-density and high-speed memory is required in rugged and harsh environments. 5. Networking and Telecommunications: These chips can be used in networking and telecommunications equipment such as routers, switches, and base stations to provide reliable and fast memory for data processing, buffering, and packet switching.Overall, the AS4C1G8D3LA-10BCNTR integrated circuit chips offer high-density, low-power, high-speed, and wide-temperature performance characteristics, making them versatile for various applications across different industries.
AS4C1G8D3LA-10BCNTR Relevant information