Home / Memory / S70GL02GS12FHVV23/
S70GL02GS12FHVV23

S70GL02GS12FHVV23

Manufacturer No:

S70GL02GS12FHVV23

Manufacturer:

Infineon Technologies

Description:

IC FLASH 2GBIT PARALLEL 64FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

S70GL02GS12FHVV23 Specifications

  • Type
    Parameter
  • Access Time
    120 ns
  • Memory Organization
    128M x 16
  • Supplier Device Package
    64-FBGA (13x11)
  • Package / Case
    64-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Size
    2Gbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    GL-S
The S70GL02GS12FHVV23 integrated circuit chips are high-performance, high-capacity flash memory devices manufactured by Cypress Semiconductor. They are specifically designed for embedded applications and have several advantages and application scenarios, which include:1. High capacity: The S70GL02GS12FHVV23 chips offer a storage capacity of 2 gigabits (256 megabytes), making it suitable for applications that require large amounts of non-volatile memory. 2. High performance: These chips provide fast read and write speeds, allowing for efficient data handling and processing in real-time applications. 3. Wide voltage range: They support a broad voltage range, typically from 2.7V to 3.6V, enabling compatibility with various system architectures and power supply configurations. 4. Advanced security features: The S70GL02GS12FHVV23 chips incorporate several security features like block locking, host lockout, and One Time Programmable (OTP) areas, ensuring protection against unauthorized access and data manipulation. 5. High reliability: They offer excellent quality and reliability, including high endurance and data retention capabilities, making them suitable for critical applications that require long-term operation and data integrity. 6. Industrial temperature range: These chips are designed to operate reliably across a wide temperature range, typically from -40°C to +85°C, making them suitable for harsh environments commonly found in automotive, industrial automation, and aerospace applications. 7. Embedded system applications: The S70GL02GS12FHVV23 chips find applications in various embedded systems, such as automotive infotainment systems, industrial control systems, networking devices, robotics, and medical devices.In summary, the S70GL02GS12FHVV23 integrated circuit chips offer high capacity, high performance, security features, reliability, and compatibility with different system architectures. These features make them suitable for a wide range of embedded applications, especially in industries that require robust and reliable flash memory solutions.
S70GL02GS12FHVV23 Relevant information