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IS64LF25636A-7.5B3LA3-TR

IS64LF25636A-7.5B3LA3-TR

Manufacturer No:

IS64LF25636A-7.5B3LA3-TR

Description:

IC SRAM 9MBIT PARALLEL 165TFBGA

Datasheet:

Datasheet

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IS64LF25636A-7.5B3LA3-TR Specifications

  • Type
    Parameter
  • Clock Frequency
    117 MHz
  • Supplier Device Package
    165-TFBGA (13x15)
  • Package / Case
    165-TBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    3.135V ~ 3.465V
  • Access Time
    7.5 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 36
  • Memory Size
    9Mbit
  • Technology
    SRAM - Synchronous, SDR
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The IS64LF25636A-7.5B3LA3-TR integrated circuit chips have several advantages and application scenarios. Some of them are:1. High-Speed Performance: These chips are designed to operate at high clock frequencies, making them suitable for applications that require fast data processing and transfer rates.2. High Capacity: The IS64LF25636A-7.5B3LA3-TR chips have a capacity of 256 megabits, which allows them to store large amounts of data. This makes them useful for applications that require extensive memory, such as smartphones, tablets, and networking equipment.3. Low Power Consumption: These chips are designed to consume low power, making them energy-efficient. This is particularly beneficial for battery-powered devices that require long battery life, such as portable electronics.4. Wide Temperature Range: The IS64LF25636A-7.5B3LA3-TR chips can operate reliably over a wide temperature range, typically from -40°C to +85°C. This feature makes them suitable for applications in harsh environments or those requiring extended temperature operation.5. Automotive Grade: These chips are designed specifically for automotive applications and comply with the strict requirements of the automotive industry. They are built to withstand the challenging conditions of automotive environments, including temperature variations, vibration, and electromagnetic interference.6. Application Scenarios: The IS64LF25636A-7.5B3LA3-TR chips find various application scenarios. Some common examples include automotive infotainment systems, telematics, navigation systems, advanced driver-assistance systems (ADAS), industrial automation, and networking equipment.In summary, the IS64LF25636A-7.5B3LA3-TR integrated circuit chips offer high-speed performance, high memory capacity, low power consumption, wide-temperature operation, and compliance with automotive industry standards. These features make them suitable for a range of applications, particularly in automotive electronics and other industries demanding reliable and high-performance memory solutions.
IS64LF25636A-7.5B3LA3-TR Relevant information