GS82564Z18GB-400I

GS82564Z18GB-400I

Manufacturer No:

GS82564Z18GB-400I

Manufacturer:

GSI Technology Inc.

Description:

IC SRAM 288MBIT PAR 119FPBGA

Datasheet:

Datasheet

Delivery:

Payment:

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GS82564Z18GB-400I Specifications

  • Type
    Parameter
  • Clock Frequency
    400 MHz
  • Supplier Device Package
    119-FPBGA (22x14)
  • Package / Case
    119-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Voltage - Supply
    2.3V ~ 2.7V, 3V ~ 3.6V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    16M x 18
  • Memory Size
    288Mbit
  • Technology
    SRAM - Synchronous, ZBT
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The GS82564Z18GB-400I integrated circuit (IC) chips have several advantages and application scenarios:1. Performance: The IC chips offer high-performance capabilities, enabling fast data processing and efficient computation. They are designed for applications that require extensive computing power.2. Multi-core architecture: These IC chips feature a multi-core architecture, allowing for parallel processing. This makes them suitable for applications that require multitasking and concurrent execution of tasks.3. Memory capacity: The chips offer a significant amount of memory capacity, allowing for storage and manipulation of large datasets. This makes them well-suited for data-intensive applications such as big data analytics, machine learning, and artificial intelligence.4. Energy efficiency: The IC chips are designed with energy efficiency in mind, allowing for optimal power consumption. This is beneficial in applications that require long operation times or are power-constrained, such as embedded systems and portable devices.5. High-speed interfaces: The chips support high-speed interfaces, enabling fast data transfer between the IC and external devices or networks. This makes them suitable for applications that require high-bandwidth connections, such as networking equipment or data centers.Application scenarios for GS82564Z18GB-400I IC chips include:1. Data centers: The chips can be used in data centers for high-performance computing, enabling faster data processing and improving the overall efficiency of operations.2. Artificial intelligence and machine learning: The IC chips' large memory capacity and high-performance capabilities make them ideal for AI and ML applications. They can handle complex calculations and large datasets efficiently, contributing to faster and more accurate results.3. Networking equipment: The high-speed interfaces of the chips make them suitable for networking equipment such as routers, switches, or network processors. They can handle the high bandwidth requirements of these devices and improve their overall performance.4. Embedded systems: The energy efficiency and multi-core architecture of the chips make them suitable for embedded systems like Internet of Things (IoT) devices, where power consumption and multitasking capabilities are crucial.5. High-performance computing: The chips can be used in various high-performance computing applications that require extensive computational power, such as scientific simulations, financial modeling, or weather forecasting.Overall, the GS82564Z18GB-400I integrated circuit chips offer high-performance capabilities, efficient power consumption, and versatility, making them suitable for a wide range of applications.