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CY7C1565XV18-633BZXC

CY7C1565XV18-633BZXC

Manufacturer No:

CY7C1565XV18-633BZXC

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C1565XV18-633BZXC Specifications

  • Type
    Parameter
  • Clock Frequency
    633 MHz
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 36
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, QDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The CY7C1565XV18-633BZXC is a high-speed, low-latency static random access memory (SRAM) integrated circuit chip manufactured by Cypress Semiconductor. Some of the advantages and application scenarios of this chip are:Advantages: 1. High speed: The CY7C1565XV18-633BZXC operates at a very high speed, which makes it suitable for applications that require fast data access and processing.2. Low latency: The chip has low access latency, providing quick response times for accessing and retrieving data.3. Large storage capacity: The CY7C1565XV18-633BZXC has a large storage capacity, offering up to 4 megabits (512k x 36) of memory space. This makes it suitable for applications that require storing significant amounts of data.4. Low power consumption: The chip is designed to operate at low power, making it energy-efficient and suitable for battery-powered devices.5. Wide temperature range: The CY7C1565XV18-633BZXC can operate reliably in a wide temperature range, making it suitable for applications in harsh environmental conditions.Application scenarios: 1. Networking equipment: The high-speed and low-latency features of the CY7C1565XV18-633BZXC make it suitable for use in networking equipment such as routers, switches, and network interface cards. It can be used for buffering and caching data packets in high-bandwidth networks.2. Telecommunications systems: The large storage capacity and low latency of the chip make it suitable for use in telecommunications systems, such as base stations, where fast and efficient data processing is required.3. High-performance computing: The CY7C1565XV18-633BZXC can be used in high-performance computing applications that require fast and reliable memory access, such as servers, supercomputers, and data centers.4. Aerospace and defense: The chip's rugged design and wide temperature range make it suitable for use in aerospace and defense applications, such as avionics systems, radar systems, and electronic warfare equipment.5. Medical devices: The chip's low power consumption and high speed make it suitable for use in medical devices, such as patient monitoring systems, where real-time data processing and low power operation are crucial.Overall, the CY7C1565XV18-633BZXC chip's high speed, low latency, large storage capacity, low power consumption, and wide temperature range make it versatile for various applications requiring fast and reliable memory access.
CY7C1565XV18-633BZXC Relevant information