Home / Memory / CY7C2663KV18-550BZXI/
CY7C2663KV18-550BZXI

CY7C2663KV18-550BZXI

Manufacturer No:

CY7C2663KV18-550BZXI

Manufacturer:

Infineon Technologies

Description:

IC SRAM 144MBIT PAR 165FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

CY7C2663KV18-550BZXI Specifications

  • Type
    Parameter
  • Clock Frequency
    550 MHz
  • Supplier Device Package
    165-FBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    8M x 18
  • Memory Size
    144Mbit
  • Technology
    SRAM - Synchronous, QDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C2663KV18-550BZXI is a high-performance synchronous SRAM (Static Random Access Memory) integrated circuit chip manufactured by Cypress Semiconductor. It offers several advantages and finds application in various scenarios.Advantages of CY7C2663KV18-550BZXI:1. High Speed: The chip operates at a frequency of 550 MHz, allowing for quick data access and efficient processing.2. Large Capacity: It has a capacity of 18 Megabits (2 Megabytes) and can store a significant amount of data.3. Low Latency: The SRAM technology used in the chip provides low access latency, ensuring fast read/write operations.4. Asynchronous and Synchronous Operation: The chip supports both asynchronous and synchronous modes of operation, making it versatile for different applications.5. Low Power Consumption: It is designed with low power consumption in mind, which helps reduce overall power requirements and extend battery life in portable devices.6. Industrial Temperature Range: The chip is built to withstand a wide temperature range, making it suitable for industrial applications that require reliable performance in harsh environments.Application Scenarios:1. Networking Equipment: The high speed and large capacity of the CY7C2663KV18-550BZXI make it ideal for use in networking equipment such as routers, switches, and network buffers. It allows for quick data processing and helps to manage high network traffic efficiently.2. Telecommunications Systems: The chip can be utilized in telecommunications systems, including base stations and network switches, where high-speed data transmission and low latency are crucial.3. Data Storage: The large capacity and fast access times of the chip make it suitable for use in storage systems, disk arrays, and high-performance storage devices. It enables quick retrieval and modification of large data sets.4. Test and Measurement Equipment: The CY7C2663KV18-550BZXI is useful in test and measurement equipment that requires high-speed memory for data buffering and advanced processing.5. Industrial Automation: The chip's ability to operate in a wide temperature range and low power consumption makes it well-suited for use in industrial automation systems, control units, and sensor networks.6. Military and Aerospace Applications: The rugged design and reliable performance of the chip make it suitable for military and aerospace applications, including avionics systems, radar systems, and communication devices.Overall, the CY7C2663KV18-550BZXI integrated circuit chip offers high performance, large capacity, and versatility, making it suitable for various applications where fast and reliable data storage and processing are essential.
CY7C2663KV18-550BZXI Relevant information