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CY7C2570XV18-600BZXC

CY7C2570XV18-600BZXC

Manufacturer No:

CY7C2570XV18-600BZXC

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C2570XV18-600BZXC Specifications

  • Type
    Parameter
  • Clock Frequency
    600 MHz
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 36
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, DDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C2570XV18-600BZXC is a specific integrated circuit (IC) chip manufactured by Cypress Semiconductor. Although detailed information about this specific chip is not readily available, it is likely a member of the C7C2570XV18 family and shares similar characteristics with other chips in the series.Advantages of the CY7C2570XV18-600BZXC or its family members may include:1. High Performance: These chips are designed to offer high-speed operation and advanced features, making them suitable for demanding applications. 2. Large Capacity: The mentioned chip may have a large memory capacity, enabling it to handle substantial amounts of data. 3. Low Energy Consumption: Cypress Semiconductor focuses on optimizing power efficiency, which allows their chips to consume less energy, making them suitable for battery-powered devices. 4. Reliability and Durability: Cypress Semiconductor is known for manufacturing reliable and durable IC chips, ensuring long-lasting performance in various conditions.Application scenarios for the CY7C2570XV18-600BZXC or similar chips can include:1. Data Storage Applications: These chips may find use in data storage systems, such as hard drives, solid-state drives, or memory cards, due to their high capacity. 2. Networking and Telecommunications Equipment: The high-performance and data handling capabilities of these chips can be beneficial for networking equipment like routers, switches, or communication devices. 3. High-Speed Computing Systems: With their fast operation and large memory capacity, these chips might be used in high-performance computing applications, including servers, supercomputers, or data centers. 4. Consumer Electronics: The chips can be utilized in various consumer electronic devices, including smartphones, gaming consoles, or digital cameras, to provide efficient and reliable data processing and storage capabilities.It is important to note that without specific datasheets or detailed information on the CY7C2570XV18-600BZXC, these advantages and application scenarios are based on general characteristics of similar IC chips from Cypress Semiconductor. Actual usage of the CY7C2570XV18-600BZXC chip may vary, and it is always recommended to consult the manufacturer's documentation for accurate information regarding its features and applications.
CY7C2570XV18-600BZXC Relevant information