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CY7C2563XV18-600BZC

CY7C2563XV18-600BZC

Manufacturer No:

CY7C2563XV18-600BZC

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C2563XV18-600BZC Specifications

  • Type
    Parameter
  • Clock Frequency
    600 MHz
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    4M x 18
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, QDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The CY7C2563XV18-600BZC is a specific model of an integrated circuit (IC) chip developed by Cypress Semiconductor. It belongs to the synchronous SRAM (Static Random Access Memory) product family.Advantages of the CY7C2563XV18-600BZC IC chip:1. High Density: The chip offers a memory capacity of 18 Mb (megabits), making it suitable for applications requiring large amounts of data storage.2. Fast Access and Transfer Speeds: It has a synchronous interface, enabling quick and efficient data access, read, and write operations. The "600" in the part number denotes a speed rating of 600 MHz.3. Low Power Consumption: The IC chip is designed to be power-efficient, making it suitable for battery-operated devices or applications where power consumption needs to be minimized.4. Burst-mode Operation: It supports burst-mode operations, allowing multiple read or write accesses to consecutive memory locations without the need for re-accessing the address bus.Application Scenarios for CY7C2563XV18-600BZC IC chips:1. Networking Equipment: The high-density memory and fast access speeds make it suitable for use in networking devices like routers, switches, and data centers. These applications often require large buffers and caching capabilities to handle high-speed data transfers.2. Telecommunications: The chip can be used in telecommunication systems that require data buffering or caching for voice or video transmission. It can handle the storage and retrieval of real-time data efficiently.3. Embedded Systems: Given its compact design and low power consumption, the IC can be integrated into various embedded systems, including industrial automation, robotics, and IoT (Internet of Things) devices. It provides efficient data storage solutions for these applications.4. High-Performance Computing: The fast access speeds make it suitable for use in high-performance computing systems, such as servers or supercomputers. It can handle memory-intensive tasks and contribute to overall system performance.Note: It's essential to consult the official documentation, data sheets, or technical specifications provided by Cypress Semiconductor for detailed information and to ensure compatibility with specific applications.
CY7C2563XV18-600BZC Relevant information