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CY7C1645KV18-450BZXI

CY7C1645KV18-450BZXI

Manufacturer No:

CY7C1645KV18-450BZXI

Manufacturer:

Infineon Technologies

Description:

IC SRAM 144MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C1645KV18-450BZXI Specifications

  • Type
    Parameter
  • Clock Frequency
    450 MHz
  • Supplier Device Package
    165-FBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    4M x 36
  • Memory Size
    144Mbit
  • Technology
    SRAM - Synchronous, QDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C1645KV18-450BZXI is a specific integrated circuit chip designed for high-performance applications. Here are some of its advantages and typical application scenarios:Advantages: 1. High-Speed Operation: This chip operates at a high-speed clock frequency, allowing for faster data processing and transfer rates. 2. Large Memory Capacity: It has a large memory capacity of 72 Megabits (9 Megabytes), which is ideal for data-intensive applications that require substantial storage. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for battery-powered devices where energy conservation is crucial. 4. Error-Correction Capability: It incorporates error-correction coding (ECC) to detect and correct memory bit errors, enhancing data reliability and minimizing data loss. 5. On-Die Termination (ODT): The ODT feature helps to optimize signal integrity and reduce signal reflections, ensuring stable and accurate data transmission.Application Scenarios: 1. Networking Equipment: The CY7C1645KV18-450BZXI can be used in routers, switches, and other networking devices to manage high-speed data packets and handle large data streams efficiently. 2. High-Performance Computing (HPC): This chip finds applications in supercomputers, servers, and other HPC systems that demand fast memory access and substantial data storage. 3. Graphics Processing: It can be employed in advanced graphics cards or GPUs, allowing for quick and seamless rendering and processing of complex visual data. 4. Telecommunications: The chip can be utilized in telecommunications infrastructure equipment for storing and processing high volumes of data, enabling efficient data transmission and communication. 5. Medical Devices: It may be used in sophisticated medical equipment like imaging devices, where high-speed data transfer and data storage capabilities are essential.It is important to note that the chip's usage and suitability may vary depending on specific requirements and system configurations.
CY7C1645KV18-450BZXI Relevant information