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CY7C2670KV18-550BZXI

CY7C2670KV18-550BZXI

Manufacturer No:

CY7C2670KV18-550BZXI

Manufacturer:

Infineon Technologies

Description:

IC SRAM 144MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C2670KV18-550BZXI Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    165-FBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    550 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    4M x 36
  • Memory Size
    144Mbit
  • Technology
    SRAM - Synchronous, DDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The CY7C2670KV18-550BZXI is a complex integrated circuit chip, specifically a high-density, high-performance SRAM (static random-access memory) device. Some advantages and application scenarios of this chip are:Advantages: 1. High-Density: The chip offers a large storage capacity, allowing for the storage of a significant amount of data in a compact form factor. 2. High-Performance: It provides fast access times and high-speed data transfer rates, enabling quick retrieval and processing of data. 3. Low Power Consumption: The chip is designed to be power-efficient, which helps minimize power consumption and enhances battery life in portable devices. 4. Wide Voltage Range: It supports a wide voltage operating range, making it suitable for various applications. 5. Easy Integration: The chip is designed to be easily integrated into existing electronic systems, facilitating seamless incorporation into different products.Application Scenarios: 1. Networking Equipment: The high-performance and high-density features of the chip make it suitable for networking equipment such as routers, switches, and communication servers, where fast data processing and storage capabilities are crucial. 2. Telecommunication Infrastructure: The chip can be used in telecommunications infrastructure applications like base stations and access points, where high-speed data storage and retrieval are required for efficient communication. 3. Industrial Control Systems: The chip's reliability, low power consumption, and large storage capacity make it valuable for use in industrial control systems, allowing for the storage and retrieval of critical data in real-time. 4. Automotive Electronics: In automotive applications, the chip can be used for advanced driver-assistance systems (ADAS), infotainment systems, and other vehicle control units, providing fast data processing and storage capabilities. 5. Aerospace and Defense: The chip's high-density storage and high-performance features are advantageous for aerospace and defense applications, including storing mission-critical data and performing high-speed computations.These advantages and application scenarios highlight the versatile nature of the CY7C2670KV18-550BZXI integrated circuit chip, finding applications across various industries that require high-performance, high-density memory solutions.
CY7C2670KV18-550BZXI Relevant information