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GS81313LD36GK-625I

GS81313LD36GK-625I

Manufacturer No:

GS81313LD36GK-625I

Manufacturer:

GSI Technology Inc.

Description:

IC SRAM 144MBIT PAR 260BGA

Datasheet:

Datasheet

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GS81313LD36GK-625I Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    260-BGA (22x14)
  • Package / Case
    260-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Voltage - Supply
    1.2V ~ 1.35V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    625 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    4M x 36
  • Memory Size
    144Mbit
  • Technology
    SRAM - Quad Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The GS81313LD36GK-625I integrated circuit chips provide several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are as follows:Advantages: 1. High Performance: The GS81313LD36GK-625I chips are designed to deliver high performance and efficiency, making them suitable for demanding applications. 2. Energy Efficiency: These chips are built with energy-efficient features, which can contribute to reduced power consumption and increased battery life in portable devices. 3. Compact Size: The chips are designed to be compact, enabling their integration into space-constrained devices or systems. 4. Cost-Effectiveness: The chips offer cost-effectiveness due to their integrated functionality and optimized design, reducing the need for additional components or circuits.Application Scenarios: 1. Portable Devices: The GS81313LD36GK-625I chips are suitable for portable devices like smartphones, tablets, or wearables, where energy efficiency, compact size, and high performance are essential. 2. Internet of Things (IoT): These chips can be applied in IoT devices, such as smart home appliances, health monitoring devices, or industrial sensors, where low power consumption, compact design, and performance are crucial. 3. Consumer Electronics: The chips can be utilized in various consumer electronics like gaming consoles, digital cameras, or multimedia devices to optimize performance while maintaining energy efficiency. 4. Wireless Communication Systems: The GS81313LD36GK-625I chips can be used in wireless communication systems like Wi-Fi routers, cellular base stations, or satellite communication systems, where high performance, energy efficiency, and compact size are critical factors.It's important to note that specific use case requirements and system integration considerations may vary, and therefore, it is advisable to consult the chip manufacturer's documentation or seek expert advice for accurate application scenarios.
GS81313LD36GK-625I Relevant information