GS82582Q36GE-333I

GS82582Q36GE-333I

Manufacturer No:

GS82582Q36GE-333I

Manufacturer:

GSI Technology Inc.

Description:

IC SRAM 288MBIT PAR 165FPBGA

Datasheet:

Datasheet

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GS82582Q36GE-333I Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    165-FPBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    333 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    8M x 36
  • Memory Size
    288Mbit
  • Technology
    SRAM - Quad Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The GS82582Q36GE-333I integrated circuit chips, also known as GSRAMs (Graphics Static Random-Access Memories), have several advantages and application scenarios:1. High Performance: These chips offer high-speed operation and low latency, making them suitable for demanding applications that require fast data access and processing, such as graphics and video processing, gaming consoles, and high-performance computing.2. Large Memory Capacity: The chips provide a large memory capacity, usually ranging from tens to hundreds of megabytes. This makes them suitable for applications that require storing and accessing a substantial amount of data, such as frame buffers, texture caches, and rendering buffers in graphics systems.3. Low Power Consumption: GSRAMs are designed to operate efficiently with low power consumption. This is crucial for portable devices, embedded systems, and other power-constrained applications that require high-performance memory without draining the battery quickly.4. Easy Integration: The chips are easy to integrate into existing systems due to their standard interfaces and compatibility with various microprocessors and microcontrollers. They can be used alongside other memory components or integrated directly into a system-on-a-chip (SoC) design.5. Reliability: GSRAMs are designed to operate reliably even in harsh environments, with features like error correction codes (ECC) that enhance data integrity and reliability. This makes them suitable for applications in aerospace, automotive, and industrial sectors, where reliability is critical.Application scenarios for GS82582Q36GE-333I integrated circuit chips include: - Graphics and video processing systems in gaming consoles, virtual reality (VR) devices, and high-end displays. - Frame buffers and texture caches in graphics cards, embedded graphics processors, and graphics accelerators. - High-performance computing systems, data centers, and servers that require fast data access and processing capabilities. - Industrial automation and control systems that need reliable and efficient memory for real-time operations. - Aerospace and automotive applications that demand high-performance memory in rugged environments. - Medical imaging systems, scientific instruments, and other data-intensive applications. - Network switches, routers, and communication equipment that require high-speed memory for packet processing.Overall, the GS82582Q36GE-333I integrated circuit chips provide high-performance, reliable, and power-efficient memory solutions for a broad range of applications requiring fast data access and processing capabilities.