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CY7C25702KV18-550BZXC

CY7C25702KV18-550BZXC

Manufacturer No:

CY7C25702KV18-550BZXC

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C25702KV18-550BZXC Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    550 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 36
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, DDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C25702KV18-550BZXC is a high-speed synchronous SRAM (Static Random Access Memory) integrated circuit chip. It offers several advantages and application scenarios:Advantages: 1. High-speed operation: The CY7C25702KV18-550BZXC operates at a speed of 550 MHz, providing fast access times and data transfer rates. This makes it suitable for applications that require high-performance memory.2. Large storage capacity: The chip has a storage capacity of 18 Megabits (2 Megabytes) organized as 2Mx9 bits. This allows for storing a significant amount of data, making it ideal for applications that demand large memory capacities.3. Synchronous interface: The chip uses a synchronous interface, which means that data transfers are synchronized with a clock signal. This ensures reliable and consistent communication between the chip and the interface, enhancing system stability and performance.4. Low power consumption: The CY7C25702KV18-550BZXC is designed to operate at low power levels, minimizing energy consumption. This is advantageous for battery-powered devices or applications where power efficiency is a concern.Application scenarios: 1. High-performance computing: The CY7C25702KV18-550BZXC can be used as a memory component in high-performance computing systems, such as servers, supercomputers, or high-end workstations. Its high-speed operation and large storage capacity facilitate quick data access and retrieval.2. Networking equipment: The chip can be employed in networking equipment like routers, switches, or network interface cards. It provides fast memory access for storing routing tables, packet buffers, or other networking data, allowing for efficient data processing and transmission.3. Telecommunications: In telecommunications applications, such as base stations or network infrastructure, the CY7C25702KV18-550BZXC can be utilized for storing control information, buffering data packets, or caching frequently accessed data. Its high-speed operation ensures smooth data processing and transfer.4. Consumer electronics: The chip can find applications in consumer electronic devices that require high-performance memory, such as gaming consoles, set-top boxes, or digital video recorders. It enables quick access to multimedia content, enhances system responsiveness, and supports demanding computational tasks.Overall, the CY7C25702KV18-550BZXC integrated circuit chip offers high-speed operation, large storage capacity, and low power consumption, making it suitable for various applications requiring reliable and high-performance memory solutions.
CY7C25702KV18-550BZXC Relevant information