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70T651S10BFG

70T651S10BFG

Manufacturer No:

70T651S10BFG

Description:

IC SRAM 9MBIT PARALLEL 208CABGA

Datasheet:

Datasheet

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70T651S10BFG Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    2.4V ~ 2.6V
  • Access Time
    10 ns
  • Write Cycle Time - Word, Page
    10ns
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 36
  • Memory Size
    9Mbit
  • Technology
    SRAM - Dual Port, Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The 70T651S10BFG integrated circuit (IC) chip is a specific model that I am not familiar with, as my training data only goes up until March 2023. However, I can provide you with some general information about IC chips and their advantages and application scenarios.Integrated circuit chips are miniature electronic circuits that are etched onto a small semiconductor material, typically silicon. They consist of various electronic components, such as transistors, resistors, and capacitors, integrated onto a single chip. IC chips offer several advantages over discrete electronic components:1. Size and Space Efficiency: IC chips allow for the integration of multiple components onto a single chip, reducing the overall size and complexity of electronic devices. This makes them ideal for applications where space is limited, such as in mobile phones, laptops, and wearable devices.2. Power Efficiency: IC chips are designed to be power-efficient, allowing electronic devices to operate for longer periods on a single battery charge. This is particularly important for portable devices and battery-powered applications.3. Reliability: The integration of components onto a single chip reduces the number of interconnections, minimizing the risk of loose connections or failures. This improves the overall reliability and durability of electronic devices.4. Cost-Effectiveness: Mass production of IC chips leads to economies of scale, making them more cost-effective compared to discrete components. This makes IC chips suitable for high-volume production applications.As for the application scenarios, IC chips find use in a wide range of industries and electronic devices. Some common application areas include:1. Consumer Electronics: IC chips are extensively used in smartphones, tablets, televisions, gaming consoles, and other consumer electronic devices.2. Automotive: IC chips are crucial for various automotive applications, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and electric vehicle components.3. Industrial Automation: IC chips are used in industrial control systems, robotics, sensors, and other automation applications to enhance efficiency and precision.4. Medical Devices: IC chips play a vital role in medical devices such as pacemakers, implantable devices, diagnostic equipment, and monitoring systems.5. Communication Systems: IC chips are used in networking equipment, wireless communication devices, satellite systems, and other telecommunications applications.It's important to note that the specific advantages and application scenarios of the 70T651S10BFG IC chip may vary depending on its design, features, and intended use. For detailed information about this particular chip, I recommend referring to the manufacturer's documentation or contacting the manufacturer directly.
70T651S10BFG Relevant information