Home / Memory / CY7C15632KV18-500BZXI/
CY7C15632KV18-500BZXI

CY7C15632KV18-500BZXI

Manufacturer No:

CY7C15632KV18-500BZXI

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 165FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

CY7C15632KV18-500BZXI Specifications

  • Type
    Parameter
  • Clock Frequency
    500 MHz
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    4M x 18
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, QDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C15632KV18-500BZXI is a high-performance synchronous SRAM (Static Random Access Memory) integrated circuit chip. It offers several advantages and can be used in various application scenarios, including:1. High Speed: The chip operates at a clock frequency of 500 MHz (or 166 MHz in DDR mode), providing fast access times and data transfer rates. It is designed for applications that require quick data processing, such as networking, telecommunications, and high-performance computing.2. Large Capacity: The chip has a capacity of 288 megabits (36 megabytes). This large memory size can handle extensive data storage and manipulation requirements in applications like routers, switches, servers, and data centers.3. Low Latency: With a random access time of 2.5 ns, the chip offers low latency, enabling rapid data retrieval and writing operations. It is suitable for latency-sensitive applications, including real-time systems, video processing, and gaming consoles.4. Low Power Consumption: The integrated circuit chip incorporates various power-saving technologies, minimizing power consumption while maintaining high performance. It is energy-efficient and suitable for portable devices, battery-powered systems, and other power-constrained applications.5. Easy Integration: The CY7C15632KV18-500BZXI chip uses a standard 165-ball BGA (Ball Grid Array) package, making it easy to integrate into existing designs. Its compatibility with other components facilitates seamless incorporation into system-level designs, reducing development time and cost.Application scenarios of CY7C15632KV18-500BZXI include:1. Networking and Communications: The chip can be used in routers, switches, network appliances, and optical networking equipment to handle high-speed data processing, packet buffering, and routing tables.2. Servers and Data Centers: It is suitable for server platforms and data centers that require large memory sizes and fast data access for virtualization, database management, and high-performance computing.3. Industrial Automation: The chip can be utilized in industrial control systems, PLCs (Programmable Logic Controllers), and robotics, providing high-speed data buffers and caching for real-time data processing and control.4. Medical Imaging: Due to its high-speed and large capacity, the chip can be used in medical imaging equipment like MRI (Magnetic Resonance Imaging) or CT (Computed Tomography) scanners, facilitating efficient storage and processing of large image data.5. Aerospace and Defense: The chip's low latency and high-performance capabilities make it suitable for radar systems, avionics, and defense-related applications that require fast data handling and processing.Overall, the CY7C15632KV18-500BZXI integrated circuit chip offers advantages in terms of high speed, large capacity, low latency, low power consumption, and easy integration. Its applications span a wide range of industries requiring high-performance memory solutions.
CY7C15632KV18-500BZXI Relevant information