CY7C1570KV18-500BZXC

CY7C1570KV18-500BZXC

Manufacturer No:

CY7C1570KV18-500BZXC

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C1570KV18-500BZXC Specifications

  • Type
    Parameter
  • Clock Frequency
    500 MHz
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 36
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, DDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C1570KV18-500BZXC is a specific type of integrated circuit chip manufactured by Cypress Semiconductor. This particular model is a 144-Mbit (2M × 72) synchronous SRAM with a 500 MHz speed grade and a voltage range of 1.7V to 1.9V. It offers several advantages and application scenarios, including:Advantages: 1. High performance: With a 500 MHz speed grade, this chip provides fast data access and processing capabilities. 2. Large memory capacity: The 144-Mbit memory capacity is suitable for applications requiring significant data storage and manipulation. 3. Synchronous operation: It operates synchronously with a clock signal, enabling precise data transfers and synchronization with other components. 4. Low power consumption: Despite its performance capabilities, this chip is designed with low power consumption, conserving energy in applications. 5. Multiple operating voltages: The voltage range of 1.7V to 1.9V allows compatibility with various power supply configurations.Application Scenarios: 1. Networking equipment: The CY7C1570KV18-500BZXC chip is suitable for data intensive applications in networking equipment such as routers, switches, and network processors. 2. High-performance computing: It can be used in high-performance computing systems that require fast and large memory capacity, such as supercomputers or data centers. 3. Embedded systems: This chip can be utilized in embedded systems that require high-speed and reliable memory access, for example, in automotive, industrial, or aerospace applications. 4. Telecommunications equipment: It can be employed in telecommunications equipment like base stations or network infrastructure devices that require high-speed memory for data processing and storage. 5. Medical devices: The chip's high-performance characteristics make it suitable for applications in medical devices, where precise and fast data processing may be critical.It's important to note that the suitability of the CY7C1570KV18-500BZXC chip for specific applications may vary based on the desired performance requirements, power constraints, and system-level considerations.