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CY7C1612KV18-300BZXI

CY7C1612KV18-300BZXI

Manufacturer No:

CY7C1612KV18-300BZXI

Manufacturer:

Infineon Technologies

Description:

IC SRAM 144MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C1612KV18-300BZXI Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    165-FBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    300 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    8M x 18
  • Memory Size
    144Mbit
  • Technology
    SRAM - Synchronous, QDR II
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
CY7C1612KV18-300BZXI is a specific type of integrated circuit chip manufactured by Cypress Semiconductor. It belongs to the family of synchronous high-performance SRAMs. Here are the advantages and potential application scenarios for this chip:Advantages: 1. High performance: The CY7C1612KV18-300BZXI chip operates at a high clock frequency of 300 MHz, enabling fast data transfer and processing. 2. Large memory capacity: It offers a 18 Megabits (2 Megabytes) memory capacity, allowing for storage of a significant amount of data. 3. Low power consumption: This chip is designed to operate at a low voltage and consume minimal power, making it suitable for battery-powered devices and energy-efficient applications. 4. High reliability: The CY7C1612KV18-300BZXI is highly reliable with a robust design, ensuring data integrity and stability in various operating conditions. 5. Easy integration: It is available in a small form factor package (BGA), making it easier to integrate into different electronic systems and designs.Application Scenarios: 1. Networking equipment: The high performance and large memory capacity of the CY7C1612KV18-300BZXI chip make it suitable for networking and telecommunications equipment, such as routers, switches, and base stations. It can be used for buffering and storing data packets and facilitating fast data transfer. 2. Industrial and automotive systems: Due to its reliability and low power consumption, this chip can be employed in industrial automation systems, control units, and automotive applications. It can store critical data, manage real-time operations, and provide high-speed processing for various control mechanisms. 3. Data storage devices: The CY7C1612KV18-300BZXI chip can be utilized in solid-state drives (SSDs) and other storage devices, where it can serve as a cache memory or main memory element. Its high performance and capacity contribute to faster and more efficient data read/write operations. 4. Consumer electronics: The chip's small form factor, combined with its performance and power efficiency, makes it suitable for various consumer electronics devices such as smartphones, tablets, and gaming consoles. It can enhance the overall performance and responsiveness of these devices. 5. Aerospace and defense applications: With its high reliability and strong performance, the CY7C1612KV18-300BZXI chip can be used in aerospace and defense systems, including satellites, avionics, and radar systems. It can handle extensive data processing and storage requirements in these critical environments.It is important to note that the specific application scenarios and advantages of the CY7C1612KV18-300BZXI chip may vary depending on the requirements and specifications of the intended use case.
CY7C1612KV18-300BZXI Relevant information